Influence of cutting conditions scaling in the machining of semiconductors crystals with single point diamond tool

Jasinevicius, Renato Goulart

doi:10.1016/j.jmatprotec.2006.03.106

Cited by 10 publications

(8 citation statements)

References 9 publications

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“…They found transition in some areas but with no specific orientation for lithium niobate, and concluded that ductile cutting of this highly brittle material required a vibration-free machine tool and low thickness of cut. Jasinevicius (2006) reported indentation and diamond turning experiments for materials such as gallium arsenide (GaAs) and indium antimonide (InSb). It was found that InSb was very favorable for ductile cutting at feeds ranging from 1.25 to 7.5 m/rev.…”

Section: Introductionmentioning

confidence: 99%

Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials

Venkatachalam

Liang

2009

Journal of Materials Processing Technology

108

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Section: Introductionmentioning

confidence: 99%

Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials

Venkatachalam

Liang

2009

Journal of Materials Processing Technology

108

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“…The study of the machining of single crystal brittle material is first based on experi mental investigations. The single point diamond turning of silicon effect of process parameters on surface finish and tool wear is reported by Jasinevicius [3] who found that the ductile regime turning is realized at large tool feed up to some hundreds of micro meters on indium antimonide which presents lower transition pressure value. Li et al [4] explained the effect of the tool wear on the ductile machining of silicon wafer, in fact in nanoscale duc tile mode cutting of silicon wafer with single crystalline diamond tools, the tool cutting edges undergo two processes simultane ously-wear on the cutting edge and wear at the tool flank.…”

Section: Introductionmentioning

confidence: 90%

Microstructure Effects on Cutting Forces and Flow Stress in Ultra-Precision Machining of Polycrystalline Brittle Materials

Venkatachalam

Fergani

et al. 2015

Journal of Manufacturing Science and Engineering

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This paper presents a physics-based analysis to quantitatively describe the effects of grain size, grain boundaries, and crystallographic orientation on the flow stress of the polycrystalline material and thereby on the cutting and thrust forces. The model has been experimentally validated, in terms of the force intensities and sensitivities to microstruc ture attributes such as the grain size and the misorientation by comparing the forces to measured data in micromachining of polycrystalline silicon carbide (p-SiC). Molecular dynamics (MD) simulations are performed to explore the effects of grain boundaries and misorientation and to validate the modeling analysis in the context of resulting force ratios.

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“…Atomistic dynamic model is proposed in [53], where the crack propagation at the silicon nanosized plastic edging is screened by a high compressive stress that brings about the formation of chips mainly by the emission of dislocations and not due to the crack propagation. The pressure dependence of the plastic -brittle transi tion in semiconductors in turning by diamond cutters is discussed in [54,55]. Studies in microindentation and turning are carried out using three different <001> crystallographically oriented semiconductors, namely, InSb, CaAs, and Si.…”

Section: Investigations Of Phase Transitions and Ductile Cutting Of Bmentioning

confidence: 99%

Studies of the ductile mode of cutting brittle materials (A review)

Kovalchenko

2013

J. Superhard Mater.

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Theoretical and experimental studies of the ductile mode of cutting brittle materials (semicon ductors, ceramics, and glass) have been considered. The ductile mode of cutting has been based on the implementation of high pressure induced phase transformations in a material machined that followed by a cutting of a transformed amorphous layer, which makes it possible to avoid cracking. Publications on studies of phase transitions in brittle materials in the course of the indentation, scratching, friction, and cutting have been reviewed. It has been shown that the cutting depth, cutting edge radius of a tool, chip thickness, tool cutting edge inclination, and crystallographic orientation of a material machined and dia mond tool as well as a type of lubricoolant are the decisive factors in implementing the ductile mode of cutting. KOVALCHENKO 1 2 Cutting length 3 4 Resistance force, N Fig. 3. Scheme of different modes of removing a brittle material with increasing normal load and cutting depth [42]: elastic (1) and elastoplastic (2) deformations, plastic (3) and brittle (4) removal of the material.

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Influence of cutting conditions scaling in the machining of semiconductors crystals with single point diamond tool

Cited by 10 publications

References 9 publications

Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials

Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials

Microstructure Effects on Cutting Forces and Flow Stress in Ultra-Precision Machining of Polycrystalline Brittle Materials

Studies of the ductile mode of cutting brittle materials (A review)

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