Influence of Cutting Speed on Subsurface Damage Morphology and Distribution in Ground Fused Silica

Schnurbusch, Georg; Brinksmeier, E.; Riemer, Oltmann

doi:10.3390/inventions2030015

Cited by 7 publications

(2 citation statements)

References 21 publications

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“…), dynamic stiffness of the grinding machine, and grinding parameters can all influence the level of subsurface damage. 13, 14 Figure 5 shows the comparison of subsurface damage of ground RB-SiC by conventional grinding and that by LAG at the laser power of 80 W. Very small micro-cracks were observed underneath the ground surface in a layer with depth 1.84 µm in conventional grinding with a depth of cut of 5 µm. The depth of damage was limited by the compliance provided by the resin-bonded grinding wheel.…”

Section: Resultsmentioning

confidence: 99%

Laser-assisted grinding of reaction-bonded SiC

Luo

Chang

et al. 2020

Journal of Micromanufacturing

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The article presents the development of a novel laser-assisted grinding (LAG) process to reduce surface roughness and subsurface damage in grinding reaction-bonded silicon carbide (RB-SiC). A thermal control approach is proposed to facilitate the process development, in which a two-temperature model (TTM) is applied to control the required laser power to thermal softening of RB-SiC prior to the grinding operation without melting the workpiece or leaving undesirable microstructural alteration. Fourier’s law is adopted to obtain the thermal gradient for verification. An experimental comparison of conventional grinding and LAG shows significant reduction of machined surface roughness (37%–40%) and depth of subsurface damage layer (22%–50.6%) using the thermal control approach under the same grinding conditions. It also shows high specific grinding energy 1.5 times that in conventional grinding at the same depth of cut, which accounts for the reduction of subsurface damage as it provides enough energy to promote ductile-regime material removal.

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Section: Resultsmentioning

confidence: 99%

Laser-assisted grinding of reaction-bonded SiC

Luo

Chang

et al. 2020

Journal of Micromanufacturing

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“…They found that surface roughness could be reduced by increasing the wheel speed due to the increase of ductile grinding probability which benefited from the reduced chip thickness. Schnurbusch et al [4] investigated the influences of cutting speed on grinding forces, surface roughness and subsurface damage in the grinding process of fused silica. They found that the changing trend of grinding forces was different from the surface roughness and subsurface damage depth, and they attributed the increase of grinding force with grinding speed to the higher rate of ductile material removal.…”

Section: Introductionmentioning

confidence: 99%

Sensitivity analysis of the surface integrity of monocrystalline silicon to grinding speed with same grain depth-of-cut

et al. 2020

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Mechanisms for removal of materials during the grinding process of monocrystalline silicon have been extensively studied in the past several decades. However, debates over whether the cutting speed significantly affects the surface integrity are ongoing. To address this debate, this study comprehensively investigates the effects of cutting speed on surface roughness, subsurface damage, residual stress, and grinding force for a constant grain depth-of-cut. The results illustrate that the changes in the surface roughness and subsurface damage relative to the grinding speed are less obvious when the material is removed in ductile-mode as opposed to in the brittle-ductile mixed mode. A notable finding is that there is no positive correlation between grinding force and surface integrity. The results of this study could be useful for further investigations on fundamental and technical analysis of the precision grinding of brittle materials.

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