J Mater Sci: Mater Electron
 2023
DOI: 10.1007/s10854-023-11722-x
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Influence of deep reactive ion etching process parameters on etch selectivity and anisotropy in stacked silicon substrates for fabrication of comb-type MEMS capacitive accelerometer

Shankar Dutta,
Isha Yadav,
Praveen Kumar
et al.
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