Influence of die semi-angle on mechanical properties of single and multiple pass drawn copper

Castro, Ana Luiza Resende de; Campos, Haroldo Béria; Cetlin, Paulo Roberto

doi:10.1016/0924-0136(96)02325-4

Cited by 38 publications

(21 citation statements)

References 5 publications

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“…The inhomogeneity of shear deformation in the drawn wire results not only in a decrease of its draw ability, but also in a decrease of its physical properties, such as its electrical conductivity, current density, and mechanical properties [14][15][16]. In this research, the possible inhomogeneous deformation of fine gold drawn wire is analyzed in terms of the texture distribution using EBSD and the bonding stability of the drawn wire is investigated using FEM.…”

Section: Introductionmentioning

confidence: 99%

Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire

et al. 2011

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Inhomogeneous microtexture evolution during the cold drawing process usually results in lean, sway, or sweep failure. The <111> longitudinal fiber texture has higher stiffness than the <100> texture and its proportion and distribution in the cross-section are critical for the bonding stability of fine gold wire. We investigated the inhomogeneous microtexture evolution of gold wire that was cold drawn through an asymmetric diamond die. In this study, the distributions of the <111> and <100> textures in a 20 μm diameter fine gold wire are the variables and their effects on the bonding stability of the wire were estimated by electron backscattered diffraction (EBSD) and finite element method (FEM) simulations. The use of a focused ion beam apparatus enabled a high quality of band contrast of the EBSD to be achieved in the exact half cross-sectional area of the fine gold wire. The detailed three-dimensional FEM results show that the asymmetric distribution of the textures plays a crucial role in increasing the spatial displacement of the gold bonding wire.

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Section: Introductionmentioning

confidence: 99%

Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire

et al. 2011

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“…Strain caused by drawing differs from that associated with tensile deformation, for the same reduction of area in both cases. This is due to the deformation heterogeneity in the drawn product, associated with localized shears superimposed on the overall external strain [4,5].…”

Section: Introductionmentioning

confidence: 99%

“…It is also applied prior to the heading of various fasteners such as bolts, nails, screws, and rivets. In the wire-drawing process, the cross section of the wire is reduced by pulling it through a conical die [1][2][3][4]. Strain caused by drawing differs from that associated with tensile deformation, for the same reduction of area in both cases.…”

Section: Introductionmentioning

confidence: 99%

On the strain inhomogeneity in drawn copper wires

2009

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Three different wire drawing schedules were attempted to examine the effects of reduction of area, dieangle and friction coefficient on the strain inhomogeneity of drawn copper wires. The microhardness distribution was studied over the transverse and longitudinal cross-sections. Inhomogeneity factor (I.F.) curves; I.F. = f(r), I.F. = g(2α) and I.F. = h(μ) were determined from the measurements.The results indicate that less strain inhomogeneity is achieved in drawing wires through dies with low angle, low friction coefficient and high reduction of area. Despite the variation in reduction of area and die-angle, the strain was distributed evenly at the center of the drawn wires. Contrary to the existing theoretical models, inhomogeneity factor versus deformation zone geometry parameter (∆) was approximated by a second order polynomial curve and not a linear relationship, as was previously postulated. A new relationship was also proposed to relate the I.F. to the calculated redundant work factor Φ.

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“…finds that die semi angle (α), lubrication influences the mechanical property of material. They find that the values of yield strength and ultimate tensile strength increase with increasing die semi-angle (α), while the values of percentage elongation decrease as die semi angle ( α) increases in drawn copper tube [22].…”

Section: Factors Affecting Springbackmentioning

confidence: 99%

A Review on Spring Back and Optimization Process

2018

IJMTER

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Abstract-Recently forming industries faces spring back drawback in forming process like cold drawing, sheet metal forming, bending etc. These forming process resulted permanent deformation by cold forming to create different shapes. Spring back defect taking place during the forming process has been emphasized. The solution to such defect problems was also given. Literature review shows that considerable amount of researches have been conducted in the field of material forming and spring-back optimization process. The present review focuses on the cold forming processes, spring back defect, factors affecting spring back, the various methods used to analyze and optimize the spring back free process. This review also opens future research work to get dimensional stability and least springback.

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Influence of die semi-angle on mechanical properties of single and multiple pass drawn copper

Cited by 38 publications

References 5 publications

Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire

Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire

On the strain inhomogeneity in drawn copper wires

A Review on Spring Back and Optimization Process

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