Influence of different substrates on the electrochromic property of polyaniline films

Abstract

The polyaniline (PANI) films doped with complex acid (sulfuric acid and sulfosalicylic acid) were prepared using the potentiostatic method on bare nickel flake (NF) and flexible polyethylene terephthalate (PET)/indium tin oxide (ITO) substrates. The contents of the PANI films ， surface elements, electrochromic property and electrical conductivity were characterized by energy dispersive X-ray spectrometer (EDS), cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS). The experimental results show that differences exist among cycle stability, redox reversibility and response time of polyaniline films on these two kinds of substrates, but the electrochromic phenomenon of the PANI films is in substantial agreement. The equilibrium transmittance spectra in the visible region (400-800 nm) for the PANI film on flexible PET/ITO substrate was obtained at different applied potential from -0.4 to 1.5 V. The results show that the transmittance of the PANI film by applying voltage is adjustable in a row and has excellent electrochromic performance.

Soldering of Mg Joints Using Zn-Al Solders

“…However, a lot of Mg particles are observed in the solder. Similar microstructure and properties for Mg joints soldered with Zn-based alloys were observed in the literature [9,19,23] for Al-based filler metal. [24] The diffusion layer at the interface is observed, and a huge amount of Mg dissolves in solder and changes its chemical composition to a-Mg + b-Mg 17 Al 12 .…”

“…However, this is much lower compared to 70 MPa for Sn40Zn [10] and 56 MPa for Mg3.0Al1.0Zn0.4Mn0.1Si. [23] Moreover, as was observed in all cases, the fracture proceeds from the eutectic a À Mg + MgZn region close to the interfacial layer. The observation in Reference 19 shows that the fracture of the soldered joint has a brittle pattern.…”

“…This is a diffusion layer, where the a-Mg solid solution is contained by Zn and Al. Such behavior was observed for solder materials of the Zn-Al system, [18] Zn-Mg-Al, [23] Zn-Mg, [9] and Sn-Zn. [10] The Mg substrate dissolves more easily compared to a Cu substrate, [15][16][17][18] and the kinetics of creation of the IMC layer are different.…”

“…[24] Furthermore, the fractographic analysis of the soldered Mg joint for both Zn and Al-based solder shows a brittle fracture pattern. [9,18,23,24] The results of mechanical property testing showed that the addition of Li and Na increases the shear strength of Mg joints to~32 and~50 MPa, respectively, compared to 28 MPa for eutectic Zn-Al. Furthermore, the obtained shear strength is slightly higher compared to 19 MPa [19] for a Zn-Al alloy filler with 19.2 (wt pct) Al.…”

Electrochemically induced regioregularity of the binding sites of a polyaniline membrane as a powerful approach to produce selective recognition sites for silver ion

“…Furthermore, Fig. 3(d) also confirms the presence of sulfur and consequently SSA in the preconcentrated membrane [48,49].…”