Copper-based alloys are widely used in the consumer electronics industry for components such as connector contacts, shielding gaskets, and terminals. Nickel silver is a general term for alloys that contain copper, nickel, and zinc. Nickel silver first became popular as a base metal for silver-plated cutlery and other silverware, notably electro-plated nickel silver, jewelery and coins. In this article, the electrochemical stability of Cu10Ni-10Zn alloy was compared with that of pure copper and two of copper ternary alloys, namely Cu-10Al-10Zn and Cu-10Al-10Ni in synthetic sweat solution, Hank's solution and in Ringer physiological solution. Corrosion behavior of the different electrodes was investigated using cyclic voltammetry, potentiodynamic polarization, and impedance spectroscopy techniques. The CVs showed peaks concerning the redox reactions for copper. These peaks were assigned to the formation and reduction of copper species. Furthermore, they showed that the copper oxidation was suppressed to a large extent by the presence of Ni and zinc in the alloy composition than the presence of Al and Zn or the presence of Al and Ni elements. Also, the results showed that the Cu-10Ni-10Zn alloy exhibited good corrosion resistance due to the formation of a protective passive film. The electrochemical impedance spectroscopy results indicated that either a duplex film with an inner barrier layer and an outer porous layer or a single passive layer was formed on the surface. The formation of such passive film was discussed, and the different alloy surfaces examined by scanning electron microscopy and subjected to EDAX analysis. The surface analysis has shown the participation of the different alloying elements in the passive film according to the alloy constituents.Graphical Abstract Addition of Ni decreases the rate of corrosion of the Cu, and the Cu-10Ni-10Zn was found to be the most corrosion-resistant alloy.