Influence of Forestry and Agriculture By-Products as Filler Materials on Thermal Conductivity of Fiberboard Panels Applied for Heat-Conditioned Building Partition Wall

Abstract

This paper presents a study on the thermal conductivity of fiberboards designed to find a proper board that would be applicable for heat-conditioned building walls. Fibers produced from forestry by-products processing, such as teak (tectona grandis), meranti ( HYPERLINK "https://id.wikipedia.org/w/index.phptitle=Shorea_acuminata&action=edit&redlink=1" \o "Shorea acuminata (halaman belum tersedia)" shorea acuminata), bayur (pterospermum javanicum) and also from agriculture by-products such as rice husk and rice bran, were then used as the materials prepared for the filler. Results showed that thermal conductivity of the board panel with such fibers were 0.0217 kW/m°C, 0.0330 kW/m°C, 0.0287 kW/m°C, 0.0253 kW/m°C and 0.0423 kW/m°C, respectively. Fiberboard panel with teak fiber as filler had the lowest thermal conductivity. It therefore could be used to significantly reduce the rate of heat transfer in such wall.