2023
DOI: 10.1109/tmag.2023.3287134
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Influence of Free Layer Surface Roughness on Magnetic and Electrical Properties of 300 mm CMOS-Compatible MTJ Stacks

Christoph Durner,
Maximilian Lederer,
Tatiana Gurieva
et al.
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Cited by 3 publications
(2 citation statements)
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“…Nevertheless, all of these solutions are created by wedge deposition, which inherently leads to significant thickness variations in wafer-level production. 65 We introduce a mitigating approach, termed "counter-deposition", aimed at reconciling the thickness variation conundrum while preserving the i-DMI strength. The concept behind this solution is outlined in Figure 5a.…”
mentioning
confidence: 99%
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“…Nevertheless, all of these solutions are created by wedge deposition, which inherently leads to significant thickness variations in wafer-level production. 65 We introduce a mitigating approach, termed "counter-deposition", aimed at reconciling the thickness variation conundrum while preserving the i-DMI strength. The concept behind this solution is outlined in Figure 5a.…”
mentioning
confidence: 99%
“…I-DMI, tilted anisotropy, and the out-of-plane effective field mechanisms have been established as resilient field-free solutions possessing low switching current density and almost 100% switching. Nevertheless, all of these solutions are created by wedge deposition, which inherently leads to significant thickness variations in wafer-level production . We introduce a mitigating approach, termed “counter-deposition”, aimed at reconciling the thickness variation conundrum while preserving the i-DMI strength.…”
mentioning
confidence: 99%