2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2024
DOI: 10.1109/eurosime60745.2024.10491463
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Influence of Geometry Effects on Thermo-Mechanical Reliability of Aluminum Bond Wires in Discrete SiC MOSFETs

Borja Kilian,
Youssef Maniar,
Jonas Gleichauf
et al.
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