Influence of Indium Addition on Whisker Mitigation 
in Electroplated Tin Coatings on Copper Substrates

Meinshausen, L.; Bhassyvasantha, S.; Majumdar, Bhaskar; Dutta, I.

doi:10.1007/s11664-015-4204-8

Cited by 14 publications

(9 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Recent work has demonstrated that addition of 6% to 10% indium prevents growth of long whiskers from electroplated Sn coatings during isothermal aging at room temperature. [74][75][76] Unlike with Pb additions, where whisker growth is mitigated but not eliminated, addition of In at this concentration level completely eliminates whisker growth.…”

Section: Effect Of In Additionmentioning

confidence: 97%

“…The efficacy of In for mitigation of whisker growth in 1-lm-, 3-lm-and 6-lm-thick electroplated Sn was assessed by comparing whisker growth rates in Sn doped with (6 wt.% to 10 wt.%) In versus pure Sn processed under identical conditions. [74][75][76] Since an electrolyte was not available initially for codepositing Sn and In, Sn-In samples on Cu substrates were made in three layers (i.e., Sn-In-Sn), followed by a diffusion heat treatment to homogenize the through-thickness composition, for comparison with a control trilayer Sn-Sn-Sn sample and a monolithic Sn coating of the same thickness (1 lm, 3 lm, or 6 lm). As seen in Fig.…”

Section: Effect Of In Additionmentioning

confidence: 99%

“…Influence on Microstructure Whisker studies on Sn-In alloys have been conducted over a range of plating thicknesses from 1.5 lm to 6 lm. [74][75][76] The microstructure changed from columnar to mixed columnar equiaxed to fully equiaxed morphology as the thickness was increased. Since whiskers were eliminated for all the thicknesses, one may conclude that whisker mitigation due to In did not occur due to the microstructure.…”

Section: Role Of In In Whisker Growth: Mechanismsmentioning

confidence: 99%

See 2 more Smart Citations

Recent Advances in Mitigation of Whiskers from Electroplated Tin

Majumdar

Dutta

Bhassyvasantha

et al. 2019

JOM

Self Cite

View full text Add to dashboard Cite

Tin whiskers pose an electrical reliability risk in the form of potential short circuits. This problem was solved in the past by adding a few percent of Pb during Sn electroplating, but with the ban on Pb in Europe and elsewhere, it has resurfaced. While various mitigation strategies have been formulated based on known whisker growth mechanisms, the electronic industry is still awaiting a satisfactory solution to the whisker growth problem in Pb-free electronics. Recent advances in the understanding and mitigation of whiskers are reviewed herein. The effects of various alloying elements/dopants are discussed in terms of the mechanisms that impact whisker growth kinetics and mitigation. Most recently, indium addition to Sn has been found to eliminate whiskers with even better mitigation performance than Pb addition. The mechanisms are discussed, and the important role of indium on the surface oxide and subsurface enrichment is highlighted.

show abstract

Section: Effect Of In Additionmentioning

confidence: 97%

Section: Effect Of In Additionmentioning

confidence: 99%

Section: Role Of In In Whisker Growth: Mechanismsmentioning

confidence: 99%

See 1 more Smart Citation

Recent Advances in Mitigation of Whiskers from Electroplated Tin

Majumdar

Dutta

Bhassyvasantha

et al. 2019

JOM

Self Cite

View full text Add to dashboard Cite

show abstract

“…Therefore, low-temperature and medium-temperature self-lubricating coatings should be prepared by liquid dope spray method, and ultra-high temperature wear-resistant anti-friction coatings should be prepared by thermal spraying. The micro structure of tin and cooper coating made by different manufacturing technologies are shown in Figure 13 [81][82][83][84][85]. The obvious cracks can be found in Figure 13a, b which manufactured by centrifugal casting and powder metallurgy sintering respectively.…”

Section: Comparisons and Characteristics Of Different Self-lubricatinmentioning

confidence: 99%

A Review of Surface Treatments for Sliding Bearings Used at Different Temperature

Cao¹,

Qin²,

Yu³

et al. 2019

Friction, Lubrication and Wear

View full text Add to dashboard Cite

The boundary lubrication and dry friction of plain bearings at different work temperature are unable to be avoided under the start and stop condition. The poor lubrication is one reason of bearing broken. In order to improve the tribological properties and select the best treatment for different bearings used at different temperature, the studies of different treatment technologies are reviewed in this paper. The review shows that the shortages of bonding fiber woven materials, inlaying solid lubricating materials, electro plating and magnetron sputtering are poor temperature resistance, low load capacity, environment pollution and low production efficiencies respectively. Based on the analyses and summaries, the liquid dope spraying and thermal powder spraying are suggested to deposit coating on the surface of bearing which working temperature is lower than 200 and above 800°C respectively. However, the technology processes, the mechanisms of spraying and self-lubrication materials should be studied further and deeply.

show abstract

“…Quite recently it has been shown that the addition of a certain amount of In can contribute to the elimination of whiskers growth in electrodeposited Sn on copper substrates under ambient temperature aging. Therefore, in terms of Sn whisker mitigation, In seems to represent a better additive than Pb [9,13,14]. In addition, due to their physico-mechanical and chemical properties, including low melting temperature, low stress, superior thermal fatigue resistance, Sn-In alloys are suitable for making connections by soldering in the assembly of integrated circuits and micromodules [15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents

Anicăi

Petica

Costovici³

et al. 2019

Coatings

View full text Add to dashboard Cite

Tin–indium alloys represent attractive lead-free solder candidates. They show lower values of melting point than pure indium, so that they are investigated as materials with significant applications potential in the electronic industry. Electrodeposition is a very convenient route to prepare Sn–In alloys. The paper presents several experimental results regarding the electrodeposition of Sn–In alloy coatings involving deep eutectic solvents (DESs), namely using choline chloride-ethylene glycol eutectic mixtures. The influence of the main operating parameters on the Sn–In alloy composition and characteristics are presented. Adherent and uniform Sn–In alloy deposits containing 10–65 wt % In have been obtained on Cu substrates. The In content was found to increase as both the In:Sn molar concentration ratio of ionic species in the electrolyte and the applied temperature increased. The use of pulsed current allowed the use of higher current densities leading to slightly higher values of In content in the alloy deposit. X-ray diffraction (XRD) analysis revealed the presence of InSn4 and In3Sn phases in agreement with the phase diagram. According to thermogravimetric analysis (TGA) measurements, values of melting points in the range of 118.6 and 127.5 °C were obtained depending on the alloy composition. The solder joints’ behavior and alloy coatings corrosion performance were also discussed.

show abstract

Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates

Cited by 14 publications

References 23 publications

Recent Advances in Mitigation of Whiskers from Electroplated Tin

Recent Advances in Mitigation of Whiskers from Electroplated Tin

A Review of Surface Treatments for Sliding Bearings Used at Different Temperature

Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents

Contact Info

Product

Resources

About