Abstract:Dislocations have been introduced in GaAs doped with indium, by plastic deformation between 773 K and 1 373 K. Transmission electron microscope observations have shown that indium increases the width of dissociation. This can explain the reduction of as-grown dislocations in In doped GaAs
“…m-2. The distance between partials was the same for the various test temperatures [60]. On the contrary, for In doped GaAs with [In ] = 5 x 1019 at.cm-3 deformed at 500 °C, the S.F.E.…”
Section: Formation Of Dislocations -The Nextmentioning
confidence: 81%
“…An even larger decrease in S.F.E. has been observed in GaAs containing 1 to 4 x 1020 at.cm-3 of In deformed between 650 and 1 000 °C [60] ; with a separation between partials of 9 ± 1 nm, the S.F.E. is 27 mJ.…”
Section: Formation Of Dislocations -The Nextmentioning
confidence: 89%
“…6 and 7). The polygonization substructure appears at higher temperature for higher indium concentration [60]. 4.2.2 Dislocation dissociation.…”
Section: Formation Of Dislocations -The Nextmentioning
The crystal quality improvement by electrical or isoelectronic doping of L.E.C. grown GaAs crystals is related to the thermoelastic modelling of stresses during growth. The dislocation structure in as-grown and annealed crystals is deduced, in particular with the help of the results of plastic deformation. The addition of various elements of the columns II-III-IV-V-VI in GaAs is considered and its influence on the establishment of the dislocation substructure is discussed
“…m-2. The distance between partials was the same for the various test temperatures [60]. On the contrary, for In doped GaAs with [In ] = 5 x 1019 at.cm-3 deformed at 500 °C, the S.F.E.…”
Section: Formation Of Dislocations -The Nextmentioning
confidence: 81%
“…An even larger decrease in S.F.E. has been observed in GaAs containing 1 to 4 x 1020 at.cm-3 of In deformed between 650 and 1 000 °C [60] ; with a separation between partials of 9 ± 1 nm, the S.F.E. is 27 mJ.…”
Section: Formation Of Dislocations -The Nextmentioning
confidence: 89%
“…6 and 7). The polygonization substructure appears at higher temperature for higher indium concentration [60]. 4.2.2 Dislocation dissociation.…”
Section: Formation Of Dislocations -The Nextmentioning
The crystal quality improvement by electrical or isoelectronic doping of L.E.C. grown GaAs crystals is related to the thermoelastic modelling of stresses during growth. The dislocation structure in as-grown and annealed crystals is deduced, in particular with the help of the results of plastic deformation. The addition of various elements of the columns II-III-IV-V-VI in GaAs is considered and its influence on the establishment of the dislocation substructure is discussed
“…In consequence, the yield stress is enhanced by dislocation locking. Jiminez-Melendo et al [90] observed a decrease in the stacking fault energy when GaAs was doped with In. They explained this effect by Suzuki segregation or direct interaction between solute atoms and stacking fault making cross-slip events more unlikely.…”
Section: Steps To Prevent Dislocation Patterningmentioning
The phenomenon of dislocation patterning during melt growth of III-V, II-VI and IV-VI semiconductor crystals is discussed. The paper is focused on the formation of cellular structures driven by the growth inherent thermo-mechanical stress. Of particular interest is the scaling of relations between cells size, dislocation density and acting shear stress. Among the materials there are characteristic similarities but also significant variations of the cell genesis. After the related compound specifics are discussed possible measures for retardation of cell patterning during growth are demonstrated.
“…In consequence, the yield stress is enhanced by dislocation locking. Jiminez-Melendo et al [90] observed a decrease in the stacking fault energy when GaAs was doped with In. They explained this effect by Suzuki segregation or direct interaction between solute atoms and stacking faults making cross-slip events more unlikely.…”
Section: Dislocation Cells and Grain Boundariesmentioning
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