2016
DOI: 10.1063/1.4947075
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Influence of inserted Mo layer on the thermal stability of perpendicularly magnetized Ta/Mo/Co20Fe60B20/MgO/Ta films

Abstract: We studied the thermal stability of perpendicular magnetic anisotropy (PMA) in Ta/Mo/CoFeB/MgO/Ta films with and without inserted Mo layers. In the absence of a Mo layer, the films show PMA at annealing temperatures below 300 °C. On the other hand, the insertion of a Mo layer preserves PMA at annealing temperatures of up to 500 °C; however, a higher annealing temperature leads to the collapse of PMA. X-ray photoelectron spectroscopy (XPS) and high-resolution transmission electron microscopy (HRTEM) were used t… Show more

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Cited by 9 publications
(8 citation statements)
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“…Surprisingly, by depositing the Mo layer with an oblique angle, fieldfree current-induced magnetization switching can be realized. This discovery implies that strong spin- 13 orbit interaction materials or spin Hall sources are not always necessary in achieving field-free current-induced switching, and "to wedge or not to wedge" during the thin film deposition process is a more critical factor.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Surprisingly, by depositing the Mo layer with an oblique angle, fieldfree current-induced magnetization switching can be realized. This discovery implies that strong spin- 13 orbit interaction materials or spin Hall sources are not always necessary in achieving field-free current-induced switching, and "to wedge or not to wedge" during the thin film deposition process is a more critical factor.…”
Section: Discussionmentioning
confidence: 99%
“…Besides Ta, several other HM materials have also been demonstrated to be suitable buffer layers for enhancing the PMA in HM/CoFeB/MgO structures. For 3 instance, thermally annealed Hf/CoFeB/MgO [11] and Mo/CoFeB/MgO [12,13] have both been shown to gain greater PMA energy densities while compare to that of Ta/CoFeB/MgO. Surprisingly, Mo/CoFeB/MgO heterostructure can survive thermal annealing up to 450˚C, which makes it an attractive candidate for replacing Ta as the standard p-MTJ buffer layer structure that can be compatible with modern CMOS processing [12][13][14][15].…”
Section: Introductionmentioning
confidence: 99%
“…When the annealing temperature is greater than 350 °C, the K eff of Ta/Mo and Ta/Hf buffer samples decrease with increasing temperature, which suggests significant Ta diffusion into the CoFeB and even MgO layers . We also observe that the CoFeB/MgO interface widths increase at temperatures above 350 °C (Figure B).…”
Section: Resultsmentioning
confidence: 66%
“…After annealing at 200 °C, the Ta buffer sample exhibits a decrease in Ms, likely due to Ta diffusion, whereas the Ms of Ta/Hf and Ta/Mo increase due to the Hf or Mo layer acting as a Ta diffusion sink . As annealing temperature increases, K eff increases rapidly for Ta/Mo and gradually for Ta/Hf, and both reach a maximum at 350 °C.…”
Section: Resultsmentioning
confidence: 99%
“…The annealing process is responsible for the strong PMA, which causes the rearrangement of elements at their interfaces, resulting in elimination of disorder generated during sputtering growth . In general, the PMA property, i.e., switching of the magnetic easy axis from parallel to perpendicular plane direction was observed for Heusler alloy films at RT and/or after annealing, which could be attributed to the improved quality of MgO layer with optimized oxygen content .…”
Section: Resultsmentioning
confidence: 99%