Influence of interface materials on the thermal impedance of electronic packages

Behaviour of the thermal impedance of buried power cables

“…A first observation is that the value of the thermal resistance R th = Z th (jx = 0) goes to a minimum for r 3 = 5 cm. This is a well known phenomenon described in several textbooks [13,14]. For r 3 = 2 cm and r 3 = 20 cm the thermal resistances are almost equal, but the two impedance plots have a quite different shape.…”

“…This technique may be well known in electrical engineering, but has only recently been extended to thermal problems in electronics and microelectronics [9][10][11][12][13][14][15]. In this work, the numerical simulations and the experiments are conducted in the time domain, and the results are subsequently converted into phasor notation by evaluating a Fourier integral.…”

Influence of lateral heat diffusion on the thermal impedance measurement of photovoltaic panels

“…This method will be used in this contribution to determine ϕ(τ ) from the experimentally measured T (t). The same technique has also been used intensively for the thermal characterization of semiconductor components and packages [9,10,11,12,13,14,15,16].…”

The Influence of an Additional Sensor on the Microprocessor Temperature

“…It turned out that for thermal problems, the Alternating Current (AC) approach was very useful. These studies have been applied to electronic packages [15][16][17][18], cooling fins [19,20], underground and overhead high voltage cables [21][22][23][24], integrated inductors [25], heat pipes [26] and photovoltaic panels [27].…”