2022
DOI: 10.2139/ssrn.4184197
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Influence of Interfacial Configuration on Bonding Properties and Thermal Conductivity of Heterogeneous Interface in Al/Graphite Composite Used for Electronic Packaging

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“…When conducting steady-state heat conduction analysis, the effects of heat convection and heat radiation on temperature and heat flux density are neglected, and the temperature at any node in the simulation process does not change with time. In this case, the temperature and heat flux densities satisfy the following equations [16][17][18]:…”
Section: Simulation Methodsmentioning
confidence: 99%
“…When conducting steady-state heat conduction analysis, the effects of heat convection and heat radiation on temperature and heat flux density are neglected, and the temperature at any node in the simulation process does not change with time. In this case, the temperature and heat flux densities satisfy the following equations [16][17][18]:…”
Section: Simulation Methodsmentioning
confidence: 99%