Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

Zhao, Shuaijie; Chen, Chuantong; Ueshima, Minoru; Haga, Motoharu; Suganuma, Katsuaki

doi:10.23919/icep58572.2023.10129766

Cited by 1 publication

(1 citation statement)

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“…Epoxy molding compounds (EMCs) are favored as encapsulation materials for semiconductor devices, safeguarding integrated circuit components against environmental challenges such as moisture, mobile-ion contaminants, temperature variations, radiation, and humidity, as well as mechanical and physical damage. Furthermore, epoxy composites, enriched with particulate fillers like fused silica, glass powder, and mineral silica, have seen extensive use as substrate materials in electronic packaging applications [12].…”

Section: Applications Of Epoxy Resinsmentioning

confidence: 99%

A Brief Overview on Epoxies in Electronics: Properties, Applications, and Modifications

Dallaev,

Pisarenko,

Papež

et al. 2023

Polymers

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This paper offers a short overview of epoxy resins, encompassing their diverse characteristics, variants, chemical modifications, curing processes, and intriguing electrical properties. Epoxies, valued for their multifunctional attributes, serve as fundamental materials across industries. In the realm of dielectric strength, epoxy resins play a crucial role in electrical insulation. This paper discusses the mechanisms governing dielectric breakdown, strategies to enhance dielectric strength, and the impact of various fillers and additives on insulation performance. Through an exploration of recent research and advancements, this paper delves into the spectrum of epoxy properties, the array of subspecies and variants, their chemical adaptability, and the intricacies of curing. The examination of electrical resistance and conductivity, with a focus on their frequency-dependent behavior, forms a pivotal aspect of the discussion. By shedding light on these dimensions, this review provides a concise yet holistic understanding of epoxies and their role in shaping modern materials science.

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Section: Applications Of Epoxy Resinsmentioning

confidence: 99%