Influence of intermetallic compounds on the adhesive strength of solder joints

Lee, Hwa Teng; Chen, Ming Hung

doi:10.1016/s0921-5093(01)01820-2

Cited by 112 publications

(50 citation statements)

References 15 publications

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“…The EDS analysis indicated that the inner layer (A) adjacent to the Cu substrate is Cu 3 Sn and the outer layer (B) is Cu 6 Sn 5 , whereas only Cu 6 Sn 5 is observed in 3 Sn layer was observed after aging for 144 h at 150°C. The Cu 3 Sn was not observed at 120°C until after 500 h, and it never appeared at 105°C even after aging for 500 h. Previous studies 3,4,7,8 proclaimed that the formation of Cu 3 Sn was inhibited because of the prevention of Sn diffusion through the Cu 6 Sn 5 layer, which forms at reflow. Previous studies also reported that the growth activation energy of Cu 3 Sn is greater than that of Cu 6 Sn 5 .…”

Section: Growth Kinetics Of the Interfacial Intermetallic Compound Upmentioning

confidence: 89%

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Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate

Chuang

Lin

2003

Journal of Elec Materi

102

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Three kinds of Sn-Ag-based lead-free solders, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge, and Sn-3.5Ag-0.07Ni (in wt.%), were selected to explore the effect of microelements (Ni and Ge) on the interfacial reaction between the solder and the Cu substrate. The thickness of the interfacial intermetallics formed with the Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge and Sn-3.5Ag-0.07Ni solders is several times that of the Sn-3.5Ag-0.7Cu solder. The added microelements converted the feature of interfacial intermetallics from pebble shape to worm shape. However, the results of x-ray diffraction (XRD) analysis suggest that the interfacial intermetallics formed with both solders have the same crystal structure. The results of energy dispersive spectroscopy (EDS) analysis show that the major interfacial intermetallic formed with the Sn-3.5Ag-0.7Cu solder is Cu 6 Sn 5 , while it is (Cu x ,Ni 1Ϫx ) 6 Sn 5 with Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge. Ni influences the interfacial intermetallics and plays the influential role on the difference of interfacial reaction rate between liquid solder and solid Cu and the morphology of interfacial intermetallics. Additionally, the growth kinetics of the interfacial intermetallic compounds (IMCs) formed in the systems of Cu/Sn-3.5Ag-0.7Cu and Cu/Sn-3.5Ag-0.07Ni at high-temperature storage was also explored.

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Section: Growth Kinetics Of the Interfacial Intermetallic Compound Upmentioning

confidence: 89%

“…7,8 The relationship between the thickness of the IMC layer and aging time is generally described as 9…”

Section: Introductionmentioning

confidence: 99%

Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate

Chuang

Lin

2003

Journal of Elec Materi

102

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“…Thus available data on bulk materials are not reliable if one considers the extremely small solder volumes (<10 -12 m 3 ) in modern microelectronic devices. Several investigations have been conducted on the thermomechanical integrity and reliability of solder joints, also with respect to specimen size, 2-4 the influence of rather brittle intermetallic compounds (IMCs) (such as Cu 3 Sn and Cu 6 Sn 5 ), on the strength 5,6 or the tensile fracture of solder joints 7 as well as deformation characteristics of solder joints during shear loading. 8 Nevertheless, very few systematic experimental studies on the effect of the reduced solder size and geometry on the mechanical performance are available in the literature.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Zimprich

Saeed

Betzwar-Kotas

et al. 2007

Journal of Elec Materi

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Future reliability and quality control of microelectronics will greatly depend on a detailed understanding of the complex mechanical and thermal properties of miniaturized lead-free solder joints. Therefore, the question of the occurrence of size effects or dimensionally induced constraints, which could change the mechanical properties of solder joints in small dimensions dramatically, has become the focus of investigation. In this study we investigated the influence of decreasing gap size on the tensile, shear, and stress relaxation behavior of solder joints to investigate the occurrence of size effects and dimensionally induced constraints, which could change the mechanical properties of solder joints significantly in micrometer dimensions. Residual stresses might remain in the solder joints during high-temperature dwell in thermomechanical fatigue. Model solder joints (Sn3.5Ag/Cu) of rectangular shape with gap sizes varying between 25 lm and 850 lm were prepared by reflow soldering to achieve near-industrial soldering processing. Scanning electron microscopy was used for analyzing the microstructure and the complex modes of fracture and crack propagation in the solder interconnect. The observed tensile behavior can be interpreted in terms of an existing theory for brazed joints to complement finite-element analysis that is usually used for a description of these phenomena.

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“…While all these methods can join dissimilar metals, metals in general form poor welds at low soldering temperatures. [18][19][20][21] Nevertheless, little has been done on the relationship between detection sensitivity of these gyroscopes and assembly methods and conditions.…”

Section: Introductionmentioning

confidence: 99%

Impact of assembly on signal detection from thin-wall rotors of micro-gyroscopes

Liu

et al. 2014

AIP Advances

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The assembly of sealed hollow rotors, a key component in achieving liquid-levitated micro-gyroscopes, represents a significant challenge. The rotor is a thin-wall cylinder composed of materials that are only 100-μm thick. Furnace soldering and hand soldering are used to join the work pieces, but produce defects evident from deformations and surface roughness. Modeling and experiments show that the deformation is related to the temperature during assembly and the mode by which heat is applied to the components. Temperature affects the deformation through thermal stress and air pressure on the rotor, but the mode of heating creates a big difference. Surface deformation of the rotor alters the detecting capacitance and introduces uncertainty in detection sensitivity of the gyroscope. Experiments show that at 220°C, furnace soldering of rotors causes a great decrease in detection sensitivity, leading to a relative uncertainty of nearly 40%. In contrast, hand soldering leads to a relative uncertainty of about 5%. Spot heating of the rotor during assembly is much better than total heating as less thermal stress is generated and the air pressure difference is almost eliminated. Lowering the temperature is helpful to as long as the connection is sufficiently strengthened.

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Influence of intermetallic compounds on the adhesive strength of solder joints

Cited by 112 publications

References 15 publications

Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate

Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Impact of assembly on signal detection from thin-wall rotors of micro-gyroscopes

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