Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn–Ag–Cu alloy

Sharma, Ashutosh; Baek, Bumgyu; Jung, Jae Pil

doi:10.1016/j.matdes.2015.07.137

Cited by 79 publications

(59 citation statements)

References 34 publications

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“…Most of the solder matrix composites are reinforced with ceramic particles like ZrO 2 , Al 2 O 3 , TiO 2 , SiC, Cu 2 O, SnO 2 , La 2 O 3 . [7,18,19,[21][22][23][24][25] The reinforcing particles suppress growth of intermetallic compounds (IMC) and provide uniform stress distribution in the matrix. [8,18,19] This method of nanotechnology would provide high strength and reliable solders for microelectronic packaging devices.…”

Section: Synthesis Of Nanocomposites Soldersmentioning

confidence: 99%

“…[7,18,19,[21][22][23][24][25] The reinforcing particles suppress growth of intermetallic compounds (IMC) and provide uniform stress distribution in the matrix. [8,18,19] This method of nanotechnology would provide high strength and reliable solders for microelectronic packaging devices. [18,20] Various processing routes like melting and casting, powder metallurgy, high-energy ball milling/mechanical alloying, physical vapor deposition, sol-gel, plasma sprayed deposition, chemical methods, and electroplating have been employed to produce solder materials.…”

Section: Synthesis Of Nanocomposites Soldersmentioning

confidence: 99%

“…Nano-sized reinforcement particles in conventional solder matrices due to their effectiveness in improving the reliability by spreading the stress uniformly in the matrix. [19,45,46] In this chapter, an effort has been made to discuss the strength related concerns by incorporating the reinforcement nanoparticles within the solder matrix using co-electrodeposition process.…”

Section: Pulse Co-electrodeposition Of Sn Based Compositesmentioning

confidence: 99%

“…They also found that the wetting is improved up to an optimum amount of La 2 O 3 nanoparticles and decreases beyond that due to the increase in surface tension and melt viscosity. [19] …”

Section: Solderabilitymentioning

confidence: 99%

“…They explained this due to the mechanism of slip mode transition of dislocation when interacting with the La 2 O 3 nanoparticles in the solder matrix. [19] …”

Section: Microhardnessmentioning

confidence: 99%

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Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Sharma¹,

Das²,

Das³

2016

Electrodeposition of Composite Materials

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This chapter provides a detailed overview of the various Sn-based composites solders reinforced with ceramic nanoparticles. These solders are lead free in nature and are produced by various process like powder metallurgy, ball milling, casting as well as simple and economic pulse co-electrodeposition technique. In this chapter, various electrodeposited composite solders, their synthesis, characterization, and evaluation of various properties for microelectronic packaging applications, such as microstructure, microhardness, density and porosity, wear and friction, electrochemical corrosion, melting point, electrical resistivity, and residual stress of the monolithic Sn-based and (nano)composite solders have been presented and discussed. This chapter is divided into the following sections: such as introduction to microelectronic packaging, synthesis routes for solders and composites, various nanoreinforcement, and the mechanism of incorporation in solder matrix, the pulse co-electrodeposition technique, the various factors affecting composite deposition, and the improved properties of composite solders over monolithic solders for microelectronic packaging applications are also summarized here.

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Section: Synthesis Of Nanocomposites Soldersmentioning

confidence: 99%

Section: Synthesis Of Nanocomposites Soldersmentioning

confidence: 99%

Section: Pulse Co-electrodeposition Of Sn Based Compositesmentioning

confidence: 99%

“…They also found that the wetting is improved up to an optimum amount of La 2 O 3 nanoparticles and decreases beyond that due to the increase in surface tension and melt viscosity. [19] …”

Section: Solderabilitymentioning

confidence: 99%

“…They explained this due to the mechanism of slip mode transition of dislocation when interacting with the La 2 O 3 nanoparticles in the solder matrix. [19] …”

Section: Microhardnessmentioning

confidence: 99%

See 3 more Smart Citations

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Sharma¹,

Das²,

Das³

2016

Electrodeposition of Composite Materials

Self Cite

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Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Liu

et al. 2017

Materials & Corrosion

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The corrosion characteristics of Sn‐3.0Ag‐0.5Cu solder under polyvinyl chloride (PVC) and polyethylene (PE) fire smoke atmospheres were investigated by weight loss method and surface characterization techniques. The corrosion kinetics results of 15‐day tests show that the mass loss of Sn‐3.0Ag‐0.5Cu solder in PE smoke is much lower than that in PVC smoke. The former shows no significant variation during the test. In contrast, the latter increases rapidly first and then presents a slow exponential increase. Microstructure analysis indicates that no obvious corrosion product appeared in PE smoke. Nevertheless, the corrosion products in PVC smoke grow larger first and then become smaller and denser. The possible growth process of corrosion products is that grain growth dominates the formation of the corrosion products at the initial stage and then the nucleation process is predominant. Furthermore, the corrosion mechanisms of Sn‐3.0Ag‐0.5Cu solder in the different fire smoke are also analyzed. Stannous oxide and stannic oxide are regarded as the corrosion products under both PE and PVC smoke atmospheres, while Sn21Cl16(OH)14O6 is only observed under PVC smoke atmosphere.

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The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

Adawiyah

Hafiz

Azlina

et al. 2019

Materialwissenschaft Werkst

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The effect of intermetallic compound layer between Sn‐4.0 Ag‐0.5Cu solder bump and electroless nickel/immersion silver (ENImAg) surface finish under different cooling rate during multiple reflow condition was investigated. The results show that the interfacial (Cu, Ni)6Sn5 intermetallic compound were formed at the early stage after the first reflow process. After multiple reflow processes, both (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 appeared as needle‐shaped at interface due to the amount of copper concentration into a solder balls. The spalling intermetallic compound of (Cu, Ni)6Sn5 was spotted in the solder which was caused by the formation of needle‐shaped from the gaps of (Cu, Ni)6Sn5. The intermetallic compound thickness and grain sizes became thicker and coarser with increasing reflow time, respectively. The results also perceived that the cooling rate condition can influence the growth of intermetallic compound formation. Faster cooling rate produced thinner intermetallic layer as well as smaller grain sizes compared to slow cooling rate. Hence, the cooling rate is a necessary parameter in the solder reflow process because it has an impact on the microstructure of morphology and intermetallic growth.

show abstract

Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn–Ag–Cu alloy

Cited by 79 publications

References 34 publications

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

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