Influence of laser texturing along with PTFE topcoat on slurry and cavitation erosion resistance of HVOF sprayed VC coating

Singh, Vikrant; Singla, Anil Kumar; Bansal, Ankur

doi:10.1016/j.surfcoat.2023.129858

Cited by 22 publications

(1 citation statement)

References 28 publications

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“…The incorporation of ceramic fillers with low CTEs is the most frequently used strategy to achieve the goal of CTE reduction in PTFE coating [4,5]. However, the severe aggregation of fillers and poor interfacial interactions between fillers and PTFE are the two main challenges for the PTFE composites due to the ultra-low surface energy of PTFE [6]. It has been reported that various fillers decorated by hydrophilic surfactants have been employed to improve their dispersibility in PTFE aqueous emulsions for preparing the composite coating [7].…”

Section: Introductionmentioning

confidence: 99%

Fluorinated Polydopamine Shell Decorated Fillers in Polytetrafluoroethylene Composite for Achieving Highly Reduced Coefficient of Thermal Expansion

Yu,

Chen,

Hou

et al. 2024

Polymers

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The noticeable difference in the coefficient of thermal expansion (CTE) for polytetrafluoroethylene (PTFE) coatings and copper substrates is a major challenge for thermal debonding of the copper-clad laminate (CCL) in high-frequency communications. Theoretically, ceramic fillers with low CTEs in the coating can effectively reduce the gap, and there remains a trade-off between the dispersibility of fillers and the interfacial interactions with the polymeric matrix. Here, we propose a novel approach to prepare a pentafluorobenzoyl chloride (PFBC)-modified polydopamine (PDA) shell on silica particles by using amidation. Such modified particles perform excellent dispersion and exhibit diminished interfacial gaps in the PTFE matrix, which highly reduces CTE to 77 ppm/°C, accounting for only 48.1% of the neat coating. Moreover, the composite exhibits enhanced mechanical strength and toughness, and consequently suppresses thermal debonding in CCL under high-temperature conditions. Therefore, results present a promising potential for its use in the next-generation CCL of high-frequency communication devices.

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