Influence of ligand structure on the stability and oxidation of copper nanoparticles

Kanninen, Petri; Johans, Christoffer; Merta, Juha; Kontturi, Kyösti

doi:10.1016/j.jcis.2007.09.069

Cited by 247 publications

(195 citation statements)

References 46 publications

(47 reference statements)

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“…However, very few studies have been reported about photocatalytic performance of Cu NPs in connection with titania [47][48][49]. The main problem with utilizing Cu NPs as a "plasmonic sensitizer" is the known fact that zero-valent copper is easily oxidized and lose plasmon resonance properties gradually under ambient conditions [54][55][56]. For example, (i) although, titania modification by strong radiolytic reduction of Cu 2+ or photodeposition under anaerobic conditions resulted in formation of zero-valent copper, Cu 0 was subsequently oxidized under ambient conditions forming CuO/TiO 2 and Cu/Cu 2 O/Cu/TiO 2 , respectively [57][58][59] and (ii) even Cu NPs immersed in water were oxidized by dissolved oxygen [60].…”

Section: Metallic Copper-plasmonic Photocatalysismentioning

confidence: 99%

On the Origin of Enhanced Photocatalytic Activity of Copper-Modified Titania in the Oxidative Reaction Systems

2017

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Modification of titania with copper is a promising way to enhance the photocatalytic performance of TiO 2 . The enhancement means the significant retardation of charge carriers' recombination ratio and the introduction of visible light activity. This review focuses on two main ways of performance enhancement by copper species-i.e., originated from plasmonic properties of zero-valent copper (plasmonic photocatalysis) and heterojunctions between semiconductors (titania and copper oxides). The photocatalytic performance of copper-modified titania is discussed for oxidative reaction systems due to their importance for prospective applications in environmental purification. The review consists of the correlation between copper species and corresponding variants of photocatalytic mechanisms including novel systems of cascade heterojunctions. The problem of stability of copper species on titania, and the methods of its improvement are also discussed as important factors for future applications. As a new trend in the preparation of copper-modified titania photocatalyst, the role of particle morphology (faceted particles, core-shell structures) is also described. Finally, in the conclusion section, perspectives, challenges and recommendations for future research on copper-modified titania are formulated.

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Section: Metallic Copper-plasmonic Photocatalysismentioning

confidence: 99%

On the Origin of Enhanced Photocatalytic Activity of Copper-Modified Titania in the Oxidative Reaction Systems

2017

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“…Addition of antioxidants, such as ascorbic acid, was shown to sufficiently retard the rate of Cu NPs oxidation [108]. Alkanethiols and oleic acid were also found to improve stability of Cu NPs in air [124]. Deposition of a graphene layer also enables effective protection of a copper core up to 200 ºC in humid air [125].…”

Section: Stabilization Of Metal Nps Against Oxidationmentioning

confidence: 99%

Metal-based Inkjet Inks for Printed Electronics

Kamyshny¹,

Steinke²,

Magdassi

2011

TOAPJ

370

242

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Abstract:A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.

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“…However, copper nanoparticles are easily oxidized in air (Park et al 2007;Kanninen et al 2008), thereby spoiling bonding properties. To solve that problem, our research group previously developed methods for fabricating chemically stable copper metal particles.…”

Section: Introductionmentioning

confidence: 99%

Metal–metal bonding using silver/copper nanoparticles

et al. 2015

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A method for producing nanoparticles composed of silver and copper and a metal-metal bonding technique using the silver/copper nanoparticles are proposed. The method consists of three steps. First, copper oxide nanoparticles are produced by mixing Cu(NO 3 ) 2 aqueous solution and NaOH aqueous solution. Second, copper metal nanoparticles are fabricated by reducing the copper oxide nanoparticles with hydrazine in the presence of poly(vinylpyrrolidone) (PVP). Third, silver/copper nanoparticles are synthesized by reducing Ag ? ions with hydrazine in the presence of the copper metal nanoparticles. Initial concentrations in the final silver/copper particle colloid, composed of 0.0075 M Cu 2? , 0.0025 M Ag ? , 1.0 g/L PVP, and 0.6 M hydrazine, produced silver/copper nanoparticles with an average size of 49 nm and a crystal size of 16.8 nm. Discs of copper metal were successfully bonded by the silver/copper nanoparticles under annealing at 400°C and pressurizing at 1.2 MPa for 5 min in not only hydrogen gas but also nitrogen gas. The shear force required to separate the bonded discs was 22.3 MPa for the hydrogen gas annealing and 14.9 MPa for the nitrogen gas annealing (namely, 66.8 % of that for hydrogen gas annealing).

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Influence of ligand structure on the stability and oxidation of copper nanoparticles

Cited by 247 publications

References 46 publications

On the Origin of Enhanced Photocatalytic Activity of Copper-Modified Titania in the Oxidative Reaction Systems

On the Origin of Enhanced Photocatalytic Activity of Copper-Modified Titania in the Oxidative Reaction Systems

Metal-based Inkjet Inks for Printed Electronics

Metal–metal bonding using silver/copper nanoparticles

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