2016
DOI: 10.4149/km_2015_2_79
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Influence of melt overheating on microstructure and soldering properties of SnBiCu solder alloy

Abstract: The melt structure transition behaviors of SnBi17Cu0.5 solder alloy were investigated in detail. By Differential Scanning Calorimetry (DSC) and electrical resistivity method, an anomalous change has been found in 835-875• C during heating process on the ρ-T and DSC curves. It reveals that a liquid-liquid structure change (LLSC) occurs in the melt. Through melt overheating treatment, the influence of LLSC on solidification process and material properties has been further studied: bigger solidification undercool… Show more

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Cited by 3 publications
(1 citation statement)
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“…This is mainly due to the restrictions imposed on the use of lead-containing alloys, and also to a combination of suitable soldering characteristics and mechanical properties they can offer [1]. Accordingly, several lead-free tin-based alloy systems with different alloying elements such as Ag, Bi, Cu, In, Ni, Sb, and Zn have been developed, and their microstructures, mechanical properties, and creep behaviour have been reported [2,3].…”
Section: Introductionmentioning
confidence: 99%
“…This is mainly due to the restrictions imposed on the use of lead-containing alloys, and also to a combination of suitable soldering characteristics and mechanical properties they can offer [1]. Accordingly, several lead-free tin-based alloy systems with different alloying elements such as Ag, Bi, Cu, In, Ni, Sb, and Zn have been developed, and their microstructures, mechanical properties, and creep behaviour have been reported [2,3].…”
Section: Introductionmentioning
confidence: 99%