Influence of multiple reflows and thermal shock on interfacial IMC of solder joints between Sn0.3Ag0.7Cu solder/pads(HASL, OSP, electrolytic Ni/Au and ENIG PCB finishes)
Abstract:The effects of multiple reflows and thermal shock on interfacial reaction of the solder joints between Sn-0.3Ag-0.7Cu solder/pads (HASL, OSP, electrolytic Ni/Au and ENIG PCB finishes) were systematically investigated in this work. The results showed that the scallop Cu 6 Sn 5 phase were formed in HASL and OSP finish pads during reflows, whereas the cylinder-type (Cu,Ni) 6 Sn 5 near the solder and needle-type (Ni,Cu) 3 Sn 4 adjacent to the Ni layer were formed in electrolytic Ni/Au and ENIG finish pads. For all… Show more
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