Influence of nano-SiO2/copper electroless composite plating on morphologies and properties of Cu thick films on Al2O3

Abstract

The copper layer was deposited on the surface of Al 2 O 3 ceramic substrate via thick film and nano-SiO 2 /-copper electroless composite plating methods. The morphologies and phase compositions of the metalized copper layers on ceramic substrate were investigated by the means of scanning electron microscope and X-ray diffraction. The electrical conductivity, adhesion strength and thermal cycling reliability were studied by four-probe method, peel test and temperature cycling test, respectively. Nano-SiO 2 had great influence on the morphologies of copper layer plating on the thick film ceramic substrate, the nano-SiO 2 played a role of the nuclei action for the copper plating, especially for the cavity on the surface of thick film copper layer. The copper layer of nano-SiO 2 /copper electroless composite plating on the thick film ceramic substrate with 0.5 g L -1 of nano-SiO 2 represented lower porosity and higher electrical conductivity. The electrical conductivity of copper layer was consistent with theoretical results based on the modified Huang's formula. It is indicated that the electrical properties of nano-SiO 2 /copper electroless composite plating copper layer could be predicted by the two-phase composite rule. The optimum adhesion strength and thermal cycling times were obtained when the content of nano-SiO 2 was 0.5 g L -1 . The reasons of these phenomena were also discussed.

Diseño sostenible de materiales cerámicos multifuncionales para el suministro eléctrico de baja potencia.

“…11. La aplicación de un tratamiento térmico mejora la adhesión del recubrimiento metálico al sustrato cerámico debido a que los granos del recubrimiento se vuelven más compactos (A. G. González et al, 2018) y la porosidad de la capa disminuye (P. Zhang, Fu, Jiang, Cao, & Tang, 2015) mejorando sustancialmente el anclaje mecánico recubrimiento/sustrato. Al analizar la resistencia de adhesión de los recubrimientos metálicos, sin tratamiento térmico, en función de las condiciones de activación del catalizador de paladio se establece que la resistencia se mejora con la temperatura de activación al pasar de 300 a 400 ºC.…”