2016
DOI: 10.1016/j.surfcoat.2016.06.026
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Influence of negative bias pulse parameters on accumulation of macroparticles on the substrate immersed in titanium vacuum arc plasma

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Cited by 10 publications
(3 citation statements)
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“…Several mechanisms have been proposed for the explanation of the decrease of macro particle attachment with the use of high voltage biasing, including enhanced ion sputtering of the protruding MPs [27], removal of loosely bonded MPs due to the incident high energy ions [28,29], evaporation of MPs in the sheath as a result of their collision with the high energy ions [30] and reflection of them by the sheath electric field [31,32] repeated negative charging of MPs due to the oscillations of plasma sheath thickness under pulsed bias, contrary to the stable plasma sheath thickness in the case of DC bias [33].…”
Section: Structural and Morphological Investigations Of The Coatingsmentioning
confidence: 99%
“…Several mechanisms have been proposed for the explanation of the decrease of macro particle attachment with the use of high voltage biasing, including enhanced ion sputtering of the protruding MPs [27], removal of loosely bonded MPs due to the incident high energy ions [28,29], evaporation of MPs in the sheath as a result of their collision with the high energy ions [30] and reflection of them by the sheath electric field [31,32] repeated negative charging of MPs due to the oscillations of plasma sheath thickness under pulsed bias, contrary to the stable plasma sheath thickness in the case of DC bias [33].…”
Section: Structural and Morphological Investigations Of The Coatingsmentioning
confidence: 99%
“…Employing a magnetic field, parallel to the propagation direction of the plasma jet, the ions concentrated on this direction and the plasma density increases. Thus, the deposition rate increases and the fraction of MPs decreases [4], Other studies, show that increasing the frequency and width of the pulses decreases the number of macroparticles [5]. Deposition of MPs into the substrate was significantly decreased after 1 min of processing at bias [6], applying short-pulsed bias leads to a 250-fold decrease in total macro particle number [7].…”
Section: Introductionmentioning
confidence: 94%
“…Numerous studies of decreasing MPs contamination were referred, such as curve magnetic filtering duct [7,8], DC negative bias to the substrates [9,10], shield plate installed between cathode and substrates [11] or by optimizing technological parameters such as increasing gas flow rate and reduction arc current [12,13] were studied extensively. However, most research focus on eliminate the MPs during their transport to the substrates rather than suppress MPs emission from cathode at the evaporation stage.…”
Section: Introductionmentioning
confidence: 99%