Influence of Nickel Layer on Electromagnetic Interference Shielding Effectiveness of CuS‐Polyacrylonitrile Fibers

Abstract

In this study, highly conductive nickel/copper sulfide‐polyacrylonitrile (Ni/CuS‐PAN) fibers were prepared by electroless nickel plating on CuS‐PAN fibers. The electromagnetic interference (EMI) shielding properties of the Ni/CuS‐PAN fibers were investigated as a function of nickel‐plating time. X‐ray photoelectron spectroscopy and X‐ray diffraction analyses were performed to examine the surface properties of the prepared Ni/CuS‐PAN. The surface morphology of the Ni/CuS‐PAN fibers was observed using scanning electron microscopy. The volume resistivity of the samples was measured using a four‐point probe electrical resistivity tester, and the EMI shielding effectiveness (EMI‐SE) was tested using an EMI shielding analyzer. The EMI‐SE of the Ni/CuS‐PAN fibers was significantly improved compared with those of the as‐received CuS‐PAN fibers. In addition, the EMI‐SE generally increased as the nickel‐plating time increased, with the highest EMI‐SE of the 50‐Ni/CuS‐PAN being approximately 45 dB at 2.05 GHz. The nickel layer was a key factor in determining the EMI‐SE of the Ni/CuS‐PAN fibers.

Improved Thermoelectric Figure of Merit in Polyol Method-Prepared Cu1–xBixS (x ≤ 0.06) Nanosheets

“…Copper vacancies present in CuS act as a p-type I–VI semiconductor with an energy band gap in the range of 1.55–2.15 eV and CuS turns to Cu 2– x S above 507 K . It has great potential with a vast range of uses such as solar cells, photocatalytic activities, solid-state batteries, conductive fibers, and thermoelectric materials. , …”

“…14 Their crystal structures vary from hexagonal to orthogonal 15 and exhibit varying electrical and optical properties depending on the stoichiometric composition, crystal structure, size, and shape of the nanoparticles (NPs). Among these, CuS attracts special attention due to its low cost, low toxicity, metal-like behavior down to 5 K, and electrical resistance 6 times smaller than that of Cu 2 S. 16 Copper vacancies present in CuS act as a p-type I−VI semiconductor with an energy band gap in the range of 1.55− 2.15 eV 3 and CuS turns to Cu 2−x S above 507 K. 17 It has great potential with a vast range of uses such as solar cells, 18 photocatalytic activities, 19 solid-state batteries, 20 conductive fibers, 21 and thermoelectric materials. 3,22 Therefore, different types of CuS NPs in different shapes as nanotubes, 23 hollow spheres, 24 nanoplates, 16 nanowires, 25 and nanorods 26 have been synthesized using polyol, 22 solvothermal, 24 sonochemical, 27 solid-state synthesis, 26 and hydrothermal 28 methods.…”

Electromagnetic shielding behavior of epoxy multi‐hybrid composites comprises of E‐glass fiber, Ag nanoparticle, and Ni nanosheet: A novel approach

“…where SE R(HMR) , SE A(HMR) , and SE M(HMR) are the attenuation of the incoming electromagnetic wave due to reflection, absorption, and multiple reflection of the hybrid multi-reinforcement shield, respectively. [17][18][19][20] The SE via EMI absorption could be estimated as:…”

Electromagnetic Interference Shielding Behavior of Magnetic Carbon Fibers Prepared by Electroless FeCoNi-Plating

“…EMI can cause not only the operational malfunction of electric devices but can also severely affect human health. The range of electronic devices and components is gradually increasing due to the commercialization of electric vehicles and, therefore, many researchers are developing EMI shielding materials [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 ].…”