Influence of normal load on the three-body abrasion behaviour of monocrystalline silicon with ellipsoidal particle

Shi, Junqin; Wei, Xinqi; Fang, Liang; Sun, Kun; Sun, Jiapeng; Han, Jing

doi:10.1039/c7ra02148h

Cited by 27 publications

(10 citation statements)

References 43 publications

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“…It is noteworthy that the critical axial ratio maybe varies under different conditions with respect to key parameters, such as temperature, normal load, and sliding velocity [40,41]. Furthermore, with the decrease of axial ratio, the friction coefficient increases obviously and even larger than 1.0 for the sliding particle, which is much larger than experimental results.…”

Section: Movement Pattern Of Abrasive Particlecontrasting

confidence: 46%

Section: Movement Pattern Of Abrasive Particlementioning

confidence: 99%

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Influence of Abrasive Shape on the Abrasion and Phase Transformation of Monocrystalline Silicon

et al. 2018

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Abstract:The effect of abrasive shape on the three-body abrasion behaviors of monocrystalline silicon was investigated via molecular dynamics. The axial ratio of abrasive particle varied from 1.00 to 0.40 to mimic abrasive shape. It has been observed that the particle's movement became sliding instead of rolling when the axial ratio was smaller than a critical value 0.46. In the abrasion process, the friction force and normal force showed an approximately sinusoid-like fluctuation for the rolling ellipsoidal particles, while the front cutting of particle caused that friction force increased and became larger than normal force for sliding particles. The phase transformation process was tracked under different particle' movement patterns. The Si-II and Bct5 phase producing in loading process can partially transform to Si-III/Si-XII phase, and backtrack to original crystal silicon under pressure release, which also occurred in the abrasion process. The secondary phase transformation showed difference for particles' rolling and sliding movements after three-body abrasion. The rolling of particle induced the periodical and inhomogeneous deformation of substrates, while the sliding benefited producing high-quality surface in chemical mechanical polishing (CMP) process. This study aimed to construct a more precise model to understand the wear mechanism benefits evaluating the micro-electro-mechanical systems (MEMS) wear and CMP process of crystal materials.

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Section: Movement Pattern Of Abrasive Particlecontrasting

confidence: 46%

Section: Movement Pattern Of Abrasive Particlementioning

confidence: 99%

Influence of Abrasive Shape on the Abrasion and Phase Transformation of Monocrystalline Silicon

et al. 2018

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“…When the axial ratio reduced from a large value and then passed over the critical value, the abrasive particle would slide changing from rolling. It is noteworthy that the critical axial ratio maybe varies under different conditions with respect to key parameters such as temperature, normal load and sliding velocity [37,38]. Furthermore, with the decrease of axial ratio, the friction coefficient increases obviously and even larger than 1.0 for the sliding particle, which is much larger than experimental results.…”

Section: Movement Pattern Of Abrasive Particlementioning

confidence: 77%

Influence of Abrasive Shape on the Abrasion and Phase Transformation of Monocrystalline Silicon

Shi¹,

Wei²,

Chen³

et al. 2017

Preprint

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Effect of abrasive shape on the three-body abrasion behaviors of monocrystalline silicon was investigated by Molecular dynamics modelling. The axial ratio of abrasive particle was varied from 1.00, i.e., a complete sphere, to 0.40 to mimic abrasive shape. The particle’s movement turns toward sliding from rolling when the axial ratio becomes less than a critical value 0.46. In the abrasion process, the friction force and normal force showed an approximately sinusoid-like fluctuation for the rolling ellipsoidal particles, while the front cutting of particle caused that friction force increased and became larger than normal force for sliding particles. The phase transformation process was tracked under different particle’ movement patterns. The Si-II and Bct5 phase producing in loading process can partially transform to Si-III/Si-XII phase and backtrack to original crystal silicon under pressure release, which also occurred in the abrasion process. The secondary phase transformation showed difference for particles’ rolling and sliding movements after three-body abrasion. The rolling of particle induced the periodical and inhomogeneous deformation of substrates, while the sliding benefited producing high-quality surface in CMP process. This study aiming to construct more precise model to understand the wear mechanism benefits evaluating the MEMS wear and CMP process of crystal materials.

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“…In fact, Shi et al [34] pointed out that sliding motion could generate superior quality surface and increase efficiency during the CMP operation. Si et al [35] reported that both sliding and rolling movements play major parts in the material removal mechanism.…”

Section: Introductionmentioning

confidence: 99%

Atomistic wear mechanisms and deformation evolution in polishing

Fang

Nguyen

2020

Preprint

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Our aim with this study was a new insight into the sub-nanoscale of polishing and provides the atomic view of the material removal and wear mechanisms by carrying out molecule dynamics simulation. We proposed and analyzed a model with a diamond abrasive particle that sliding or rolling on the surface of GaN workpieces. The authors investigated, step by step, the effects of polishing depths, speeds, abrasive sizes, and crystalline orientations on the wear mechanisms and material removal. The wear mechanisms of the sliding motion were adhering, ploughing, and cutting, depending on the depths. While the wear mechanisms of rolling motion are adhering and ploughing. Notably, in both stages of sliding and rolling, there is an existence of a critical point at 5.0 Å depth when we considered the deformation behaviors. Below that critical point, the GaN workpiece will present an elastic deformation. From the aforementioned point, the workpiece would be plastically deformed. Besides, from 10 Å depth, the dislocation began to appear and evolute simultaneously with the development of the maximum shear stress. The sliding motion on the Ga-face could remove a greater number of atoms than that of the N-face. Moreover, direction [1-100] on Ga-face requesting more forces to polish than direction [11-20]. In conclusion, the main achievements that contribute to the field can be summarized as follows: the atomistic wear mechanisms of sliding and rolling motions, material removal, and the role of rolling motion at the sub-nanoscale during the ultrafine flat polishing process.

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Influence of normal load on the three-body abrasion behaviour of monocrystalline silicon with ellipsoidal particle

Abstract: Currently, monocrystalline silicon has been widely applied in micro-electro-mechanical systems (MEMSs).

Cited by 27 publications

References 43 publications

Influence of Abrasive Shape on the Abrasion and Phase Transformation of Monocrystalline Silicon

Influence of Abrasive Shape on the Abrasion and Phase Transformation of Monocrystalline Silicon

Influence of Abrasive Shape on the Abrasion and Phase Transformation of Monocrystalline Silicon

Atomistic wear mechanisms and deformation evolution in polishing

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