Influence of oxygen on the joining between copper and aluminium nitride

Determination of interfacial properties between AlN and aluminum beneath salt at high temperature

“…Despite the fact that this datum is the only published value to date, it should not be considered as a starting point for generating accurate data. Though, J. Jarrige et al [21] used the datum published in reference [9] for the calculation of interfacial properties in the AlN-copper system.…”

Asymmetry of adsorption of oxygen at wurtzite AlN (0001) and(0001¯)surfaces: First-principles calculations

“…Unlike in GaN where O behaves as a shallow donor, it acts as a deep center in AlN due to the wide band gap of AlN. 11 Experimental studies have also shown that O absorption at the AlN surface has effects on the surface roughness, 12 surface chemical stability, 13 surface contact with metal, 14 surface acoustic properties, 15,16 and thermal conductivity. 17 However, there is a lack of theoretical study of oxygen adsorption at the AlN surface.…”

Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications

“…It is worth noting that the actual annealing parameters were not disclosed by Rogers-Curamik. However, from the literature presented in section 1 (refs [2,3,4,5,6]), one can estimate that Cu B and Cu C underwent a maximum temperature of ≈ 1070°C.…”

“…For a 3-10 µm-thick oxide layer, the DBC structure exhibits a very good bond (140 MPa shear strength [3]). Details on the assembly process are given in [4] for Al 2 O 3 ceramic, while [5] describes a variant using AlN, which also requires an oxidation of the ceramic to form a superficial Al 2 O 3 layer. From an application point-of-view, several implementations, including vias through the ceramic or hermetic packages, are presented in [6].…”