Influence of PCB design and materials on chip solder joint reliability

Abstract

This paper describes chip solder joint reliability on three substrate types: one board SMI (aluminium substrate) and two different boards in FR4. Several chip sizes and types (resistor, capacitor) were assembled on these boards. Accelerated Thermal cycles (ATC) -55/+125°C were applied to evaluate the lifetime of chip solder joints. The different results obtained showed an important dispersion in Time To Failure (TTF) according to the substrate type. Literature data confirm this dispersion. To understand this discrepancy Finite Element Modelling (FEM) analyses were used to evaluate the influence of PCB design and materials on solder chip component reliability. The simulations permit to identify which parameters are the most influent.

Design and Implementation of Solder Paste Dispenser Based on Linear Drive System

“…The drive linear system is used to push the plunger along the inside of the barrel to eject and drop the solder paste. Further to examine the performance, the solder paste dispenser of the design has been verified by experiments using SMD resistor solder pads of different sizes for R0603, R0805, and R1206 on PCB [12] .…”