2014
DOI: 10.1007/s00339-014-8606-x
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Influence of phase and morphology on thermal conductivity of alumina particle/silicone rubber composites

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Cited by 58 publications
(21 citation statements)
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“…The thermal management of electronics requires elastomeric materials with high thermal conductivities between rigid surfaces of electronics and metal-plate heat sinks to minimize thermal resistance. Therefore, thermal pads based on thermally conductive elastomer nanocomposites have found numerous applications in thermal interface management for electronic devices [2,11,12]. Thermal pads offer good thermal performance without the mess A c c e p t e d M a n u s c r i p t associated with thermal grease and thus saves time by accelerating the assembly process [248].…”
Section: Elastomeric Heat Sinks and Thermal Interface Managementmentioning
confidence: 99%
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“…The thermal management of electronics requires elastomeric materials with high thermal conductivities between rigid surfaces of electronics and metal-plate heat sinks to minimize thermal resistance. Therefore, thermal pads based on thermally conductive elastomer nanocomposites have found numerous applications in thermal interface management for electronic devices [2,11,12]. Thermal pads offer good thermal performance without the mess A c c e p t e d M a n u s c r i p t associated with thermal grease and thus saves time by accelerating the assembly process [248].…”
Section: Elastomeric Heat Sinks and Thermal Interface Managementmentioning
confidence: 99%
“…Thermally conductive elastomer nanocomposites can possess a combination of high thermal conductivity and high elasticity. Therefore, thermally conductive elastomer nanocomposites exhibit unique features in many important applications, such as soft thermal pads for electronics, for which thermal management is critical [2,11,12].…”
Section: Introductionmentioning
confidence: 99%
“…The elliptical flat morphology of Al 2 O 3 particles can be clearly seen from Figure 1E,F. In Figure 1G, the XRD pattern of the Al 2 O 3 particles is consistent with the XRD pattern of highly crystalline Al 2 O 3 , indicating the highly crystalline of Al 2 O 3 particles good thermal conductivity of filler . The characteristic peaks of the Al 2 O 3 particles shown in Figure 1G are consistent with the characteristic peaks of the α‐Al 2 O 3 , indicating that the Al 2 O 3 used in the experiment is an α‐Al 2 O 3 and has good thermal conductivity.…”
Section: Resultsmentioning
confidence: 90%
“…It is mass produced by reduction of graphene oxide (layer number: 3‐5) by a solution method. Alumina (Al 2 O 3 ) powder (DCA‐05W, diameter: 5.5 ± 0.5 μm, density: 3.90 g cm −3 , surface area: 1.06 m 2 g −1 ) was purchased from Dongchao New (Dongguan) Materials Technology Co, Ltd, and it is a kind of crystalline stable α‐crystalline Al 2 O 3 with high thermal conductivity . PLA pellets (4032D, density: 1.24 g cm −3 , Mw: 170 000) used as the matrix in this study is commercially available material from Nature Work (USA) LLC.…”
Section: Experimental Workmentioning
confidence: 97%
“…CO and CO 2 are also generated at elevated temperature to hinder the formation of conductive carbonization passage . Alumina material has not only good insulation property but also high thermal conductivity . With alumina in HTVSR, a heat transfer network is formed, which can enhance the thermal conductivity of silicone rubber and reduce its surface temperature .…”
Section: Introductionmentioning
confidence: 99%