Influence of plasma treatment on the improvement of surface energy [packaging]

Paproth, A.; Wolter, K.-J.; Herzog, Thomas; Zerna, Thomas

doi:10.1109/isse.2001.931005

Cited by 5 publications

(3 citation statements)

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“…Plasma cleaning of the adherent surfaces would seem to be a logical step to improve adhesion. Herzog et al (2004) and Paproth et al (2001) have shown that plasma treatments increase the polar component of surface energy, but preliminary data show no adhesion improvement with either argon or oxygen plasmas, despite removal of organic contaminants and oxides Morris et al, 1999;Morris and Probsthain, 2000). Experimental studies consistently show that the mechanical component of adhesion dominates (Liong et al, 2002;Chow et al, 2002), with best results from surface roughening, (which may be accomplished by high-energy plasmas.)…”

Section: Mechanical Propertiesmentioning

confidence: 99%

Isotropic conductive adhesives in electronics

Morris

2011

Advanced Adhesives in Electronics

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Section: Mechanical Propertiesmentioning

confidence: 99%

Isotropic conductive adhesives in electronics

Morris

2011

Advanced Adhesives in Electronics

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“…Moreover, it is reported that the antibacterial activity of Ag NPs is size and shape dependent [12,13]. Therefore, in recent years, a lot of efforts have been directed into the modification of surface roughness of thin films, resulting in the improvement in grain size [14], surface energy [15] and such properties as wettability (hydrophilic or hydrophobic) [16,17], formation of highly reactive chemical species, in particular reactive oxygen (ROS) [18] and nitrogen species (RNS) [19] on the metallic thin film surfaces. As a result, to enhance the stability and durability, sensitivity, and antimicrobial activity of SPR sensors based on thin films, their surfaces should be modified by cold plasma (CP) treatment.…”

Section: Introductionmentioning

confidence: 99%

Effects of different gas flow rates and non-perpendicular incidence angles of argon cold atmospheric-pressure plasma jet on silver thin film treatment

et al. 2019

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In this study, the influences of variations in the gas flow rate and incidence angles of argon cold atmospheric-pressure plasma jet on the morphology and absorption spectra of silver thin films (60 nm, 80 nm, and 100 nm film thickness) are investigated. To evaluate the surface morphology, atomic force microscopy (AFM) was employed on the silver thin film surface before and after plasma processing. To analyze the effect of plasma treatment on the grain size, the one-dimensional AFM surface profiles of Ag thin films are approximated using a Gaussian function. The absorbance of Ag thin films is measured in wavelength range of 190-1100 nm utilizing UV-Vis absorption spectrometer. Compared to the gas flow rates 0.5 standard litter per minute (SLM) and 2 SLM, surface treatment of Ag thin film with gas flow rate of 1 SLM increased the valley depth, the peak valley height, and the distance between two deepest valleys remarkably. A sequential argon plasma treatment (2-min plasma treatment perpendicular to surface was followed by 2-min plasma processing with non-perpendicular incidence angle of 60°) offers considerable improvement in the uniformity of grains and also changes shape of grains, especially the peak height (about 44 times higher than untreated sample) and area of grains (almost 136 times greater than untreated sample) which can be applicable for optical sensing technology. Keywords Non-perpendicular incidence angle of argon cold atmospheric-pressure plasma jet (APPJ) • Gas flow rate • Absorption spectra • Surface morphology • Analysis of silver grain size • Gaussian function

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“…In this way, without affecting the bulk properties, materials with desired properties can be obtained, such as an improved wettability and better adhesion [1]. Wettability is a vital parameter [2] to judge the quality of surface plasma treatment since it can be expressed as surface energy using Young's equation [3]. The water contact angle used in wettability measurement is an indicator of the adhesion trend [4].…”

Section: Introductionmentioning

confidence: 99%

The effect of plasma etching process on rigid flex substrate for electronic packaging application

Yung

Liem

Choy

et al. 2009

2009 International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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The demand for high-speed signal transmission circuits triggers the use of polymer substrates having the superiorly mechanical and electrical reliability properties. Foremost among them, rigid-flex polymer substrates are being used in the printed circuit board (PCB) of electronic packaging technologies by utilizing their property compatible with device miniaturization and packaging integration. Modifying the polymer interfacial property further before subsequent processing, plasma treatment is employed to adjust the physical and chemical changes of the surface and subsurface. One special issue of plasma-induced change is the surface roughness (hydrophobic or hydrophilic) depending on every detail of process cycle conditions. Thus, it is difficult to be precisely controlled so as to deliver the desirable outcome.This study employs Taguchi experimental method to find the parameter critical to plasma etching particularly on rigid flex substrate. In contrast to the traditional use of atomic force microscopy (AFM) and/or scanning electron microscopy (SEM) to characterize the surface roughness morphology and thus deduce the optimal process conditions. It adopts a set of standard orthogonal arrays to determine parameters configuration and analysis results. These kinds of arrays use a small number of experimental runs but obtain maximum information and have high reproducibility and reliability. Taguchi method provides the experimenter with a systematic and efficient approach for conducting experiments to determine near optimum parameter settings for performance and cost.

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Influence of plasma treatment on the improvement of surface energy [packaging]

Cited by 5 publications

References 0 publications

Isotropic conductive adhesives in electronics

Isotropic conductive adhesives in electronics

Effects of different gas flow rates and non-perpendicular incidence angles of argon cold atmospheric-pressure plasma jet on silver thin film treatment

The effect of plasma etching process on rigid flex substrate for electronic packaging application

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