Influence of polyethylene glycol inhibitors on properties of electroplated copper layer

Abstract

Inhibitor is one of the important additive components in electrodeposited copper. As a common inhibitor, the concentration of PEG8000 has an important effect on electrodeposited copper. In this article, different concentrations of polyethylene glycol-based organic additives were added to the acidic electrolyte, and their effects on the electrochemical behavior of copper electrodeposition were investigated by galvanostatic test, cathodic polarization curve test, and cyclic voltammetry test. In addition, the surface morphology and crystallographic orientation of the obtained copper layers were analyzed by SEM and XRD. The results show that with the increase of PEG8000 concentration in the electroplating solution system, the inhibitory effect of PEG8000 on electroplating copper becomes stronger, and the copper surface density obtained by electroplating is better.