2007
DOI: 10.1117/12.753027
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Influence of process conditions on the optical properties HfO 2 /SiO 2 thin films for high power laser coatings

Abstract: We investigate the variations that occur with changes in the number of layers and with the use of the assist beam main and assist beam energy on the morphology of HfO 2 /SiO 2 quarter wave stacks deposited by dual ion beam sputtering. We show how the addition of sequential HfO 2 /SiO 2 bilayers, up to eight, affects the surface roughness and micro-crystallinity of the top HfO 2 layer. We also show that use of the assist source significantly smooths the surface while simultaneously reducing microcrystallinity. … Show more

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Cited by 14 publications
(10 citation statements)
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“…Unless stated otherwise the samples were quarter-wave (λ = 800 nm) thick hafnia (HfO 2 ) films deposited on super-polished fused silica substrates using dual ion-beam sputtering (DIBS) with a hafnium-metal target [15]. Figure 2 shows the breakdown fluence as a function of the number of pulses illuminating one and the same sample site at atmospheric pressure (630 Torr at an elevation of 1,600 m) and for 3x10 -7 Torr.…”
Section: Methodsmentioning
confidence: 99%
“…Unless stated otherwise the samples were quarter-wave (λ = 800 nm) thick hafnia (HfO 2 ) films deposited on super-polished fused silica substrates using dual ion-beam sputtering (DIBS) with a hafnium-metal target [15]. Figure 2 shows the breakdown fluence as a function of the number of pulses illuminating one and the same sample site at atmospheric pressure (630 Torr at an elevation of 1,600 m) and for 3x10 -7 Torr.…”
Section: Methodsmentioning
confidence: 99%
“…In this work, we have identified oxygen interstitials. Signatures of these defects were also found in IBS HfO 2 and Ta 2 O 5 and were observed to scale with the thickness of the film [13,17]. However, it is possible that other types of defects, such as oxygen vacancies, could be affecting absorption, and stress in the amorphous Sc 2 O 3 .…”
Section: Discussionmentioning
confidence: 88%
“…The deposition process used for planarization is dual ion beam sputtering (IBS) [21]. The secondary ion source is pointed normal to the substrate and used for etching the deposited silica layers.…”
Section: Experiments and Resultsmentioning
confidence: 99%