2014
DOI: 10.1016/j.tsf.2014.06.052
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Influence of process parameters on atomic layer deposition of ZrO2 thin films from CpZr(NMe2)3 and H2O

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Cited by 19 publications
(11 citation statements)
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“…The thick ZrO 2 films grown with CpZr(NMe 2 ) 3 and O 3 at 250 and 300 °C exhibited only the cubic phase, whereas that grown at 350 °C showed a mixture of the cubic and monoclinic phases [21]. The thick ZrO 2 films that were grown with CpZr(NMe 2 ) 3 and H 2 O at temperatures from 200 to 400 °C contained mixtures of the tetragonal, cubic, and monoclinic phases [22]. The maximum intensity of the dominant peak of the tetragonal phase at 30.5° was obtained for the film grown at 250 °C and the small intensity of the peak at 28.2° from the monoclinic phase remained constant for films grown at 200 to 300 °C.…”
Section: Resultsmentioning
confidence: 99%
“…The thick ZrO 2 films grown with CpZr(NMe 2 ) 3 and O 3 at 250 and 300 °C exhibited only the cubic phase, whereas that grown at 350 °C showed a mixture of the cubic and monoclinic phases [21]. The thick ZrO 2 films that were grown with CpZr(NMe 2 ) 3 and H 2 O at temperatures from 200 to 400 °C contained mixtures of the tetragonal, cubic, and monoclinic phases [22]. The maximum intensity of the dominant peak of the tetragonal phase at 30.5° was obtained for the film grown at 250 °C and the small intensity of the peak at 28.2° from the monoclinic phase remained constant for films grown at 200 to 300 °C.…”
Section: Resultsmentioning
confidence: 99%
“…The situation with water is particularly interesting, because of the high reactivity of Cp-based precursor molecules with water in the gas phase. ALD processes using Cp-based precursors for oxide films generally have high growth rates and include those for the deposition of ZrO 2 , , HfO 2 , ,,, and metal oxides of group 2 and rare-earth elements, among others. Surprisingly, the growth rate achieved with water has been found in some cases not only to exceed that of the analogous ozone process but also to be relatively high for typical ALD processes. , These intriguing results provide a strong motivation to investigate the interaction of a Cp-based molecule with water within an ALD situation, that is, when water is adsorbed on the surface.…”
Section: Introductionmentioning
confidence: 99%
“…35 Atomic layer deposited hafnia has been made from HfCl 4 and H 2 O at 300 • C. 36,37 Film growth at 300 • C was analyzed for comparison, using different metal precursors HfCl 4 and HfI 4 , and the oxidizer was water. 38 HfCl 4 -H 2 O and HfI 4 -O 2 processes were compared in the temperature range of 300-600 • C. 39 HfO 2 and ZrO 2 have been fabricated, using Hf[N(CH 3 ) 2 ] 4 (TDMA-HF) and ZyALD ((tris(dimethylamino)cylcopentadienyl)-zirconium), as respective Hf and Zr precursors, and O 3 as oxidizer, at 260 • C and 285 • C. 20 ZrO 2 films have been atomic layer deposited using (CpMe) 2 ZrMe 2 and (CpMe) 2 Zr(OMe)Me as Zr precursors, and O 3 as the oxidant at 300 or 350 • C. 40 ZrO 2 films from tris(dimethylamino)cyclopentadienylzirconium CpZr(NMe 2 ) 3 and H 2 O, were investigated using real-time characterization of the growth process at substrate temperatures ranging from 120 to 350 • C. 41 ZrO 2 growth has been carried out in the case of ZrCl 4 and H 2 O as precursors 37 and this process has also been monitored in real time. 42 Zirconia has also been deposited from TEMAZ (tetrakis(ethylmethylamide) zirconium) and water.…”
mentioning
confidence: 99%