Influence of pulse plating parameters on the electrocodeposition of matrix metal nanocomposites

Non-Cyanide Electrodeposited Ag–PTFE Composite Coating Using Direct or Pulsed Current Deposition

“…Although the PCP process is able to directly influence the deposited coating by increasing the amount of embedded PTFE, the wear performance of the coating is still dependent on other factors, such as the properties of the MMC deposit. This is in line with the findings of previous work carried out by Thiemig et al [22] and Zimmerman et al [23] to improve the performance of coatings, which concluded that the performance improvements were primarily due to changes in grain sizes or growth modes in the MMC, as opposed to the presence of foreign particles. The same phenomenon of changes in MMC growth sizes was also observed during the experiments.…”

Interactions and dispersion stability of aluminum oxide colloidal particles in electroless nickel solutions in the presence of comb polyelectrolytes

“…While co-deposition of micrometer sized particles was extensively used in the past, recent research activities, especially in the electrodeposition arena, are focused on the incorporation of submicrometer and nanoparticles [2][3][4][5][6][7][8][9][10][11][12][13]. This has several reasons: (a) micrometer sized particles produce relatively rough surfaces, (b) hard, micrometer sized particles released between two moving surfaces can induce harmful grinding effects [14], and (c) in the absence of strong electric fields, sedimentation in EN baths governs the deposition of micrometer sized particles.…”

Pulse co-electrodeposition and characterization of NiW–WC composite coatings

“…Hence, pulse plating has become an important technique for the electrodeposition of metals and alloys [10]. It is however only recently that increasing attention has been given to the use of pulse plating technique for improving the quality of the co-deposits [1,11]. The studies on the co-deposition of some Ni composites, including Ni-Al 2 O 3 [3,12] and Ni-SiC [13], for * Corresponding author.…”