Influence of SAC0307-TiO<sub>2</sub> Composite Solder Joint on Thermal Parameters of MOSFETs

Pietruszka, Adrian; Górecki, Paweł; Skwarek, Agata

doi:10.1109/isse57496.2023.10168479

Cited by 2 publications

(3 citation statements)

References 14 publications

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“…Such influence was already observed for several additions, including nanopowders and nanofibers, e.g. Al 2 O 3 , ZnO, SiC, TiO 2 and Co-GNSs (Skwarek et al, 2022;Rajendran et al, 2023;Pietruszka et al, 2023;Tamizi et al, 2024). It has been experimentally proven that the precise quantity of added nanoparticles can induce notable alterations in the microstructural composition of the solder joint.…”

Section: Introductionmentioning

confidence: 68%

“…Currently, numerous research papers are focused on enhancing the assembly of power devices (Calabretta et al, 2021;Pietruszka et al, 2021) for better heat management. Using composite solder joints is emerging as a promising approach for effective thermal management in power devices (El-Daly et al, 2013;Skwarek et al, 2022;Pietruszka et al, 2023).…”

Section: Introductionmentioning

confidence: 99%

“…A variety of metals, ceramics and intermetallic compounds (IMCs) have been selected for the production of composite solders with enhanced reinforcement (Skwarek et al, 2022;Pietruszka et al, 2023;Tamizi et al, 2024;Tikale and Narayana Prabhu, 2020;Nasir et al, 2019). These reinforcing particles ought to possess a diminutive size and establish self-organized dispersive systems, thereby facilitating heterogeneous nucleation.…”

Section: Introductionmentioning

confidence: 99%

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Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Pietruszka,

Górecki,

Skwarek

2024

SSMT

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Purpose This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint. Design/methodology/approach Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven. Findings Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance Rthj-a of MOSFETs depends on TiO2 concentration in the composite solder joint reaching the minimum Rthj at 0.25 Wt.% of TiO2. Research limitations/implications Mechanical strength: TiO2 reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO2 concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO2 does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly. Practical implications Incorporating TiO2 enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO2 composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous quality control during soldering ensures consistent thermal performance and mitigates negative effects on mechanical strength. Social implications The integration of TiO2 reinforcement in solder joints impacts thermal properties crucial for power semiconductor assembly. However, its influence on mechanical strength is limited, potentially affecting product reliability. Understanding these effects necessitates collaborative efforts between researchers and industry stakeholders to develop robust soldering techniques. Ensuring optimal TiO2 concentration through experimental validation is essential to maintain product integrity and safety standards. Additionally, dissemination of research findings and best practices can empower manufacturers to make informed decisions, fostering innovation and sustainability in electronic manufacturing processes. Ultimately, addressing these social implications promotes technological advancement while prioritizing consumer trust and product quality in the electronics industry. Originality/value The research shows the importance of the soldering technology used to assemble MOSFET devices.

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Section: Introductionmentioning

confidence: 68%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Pietruszka,

Górecki,

Skwarek

2024

SSMT

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Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO₂ composite solder paste

Górecki,

Pietruszka,

Skwarek

et al. 2023

2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Influence of SAC0307-TiO₂ Composite Solder Joint on Thermal Parameters of MOSFETs

Cited by 2 publications

References 14 publications

Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO₂ composite solder paste

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Influence of SAC0307-TiO2 Composite Solder Joint on Thermal Parameters of MOSFETs

Cited by 2 publications

References 14 publications

Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components

Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components

Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO2 composite solder paste

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Influence of SAC0307-TiO₂ Composite Solder Joint on Thermal Parameters of MOSFETs

Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components

Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO₂ composite solder paste