2014
DOI: 10.1016/j.jallcom.2014.05.173
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Influence of Silver nanoparticles addition on the phase transformation, mechanical properties and corrosion behaviour of Cu–Al–Ni shape memory alloys

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Cited by 67 publications
(23 citation statements)
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“…In general, the presence of Cu, Al, and Fe can be seen, which are the most important elements of the coating, with Zn from the substrate and Na and Cl from the corrosive electrolyte. The presence of these elements makes it possible to conclude that after the electrochemical tests, a coating of thin salt crystals and corrosion products with cuprous chloride (CuCl) was produced [26]. Figure 13 shows the Bode diagrams of Al-Cu coating applications at 1 h immersion time.…”
Section: Electrochemical Measurementsmentioning
confidence: 99%
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“…In general, the presence of Cu, Al, and Fe can be seen, which are the most important elements of the coating, with Zn from the substrate and Na and Cl from the corrosive electrolyte. The presence of these elements makes it possible to conclude that after the electrochemical tests, a coating of thin salt crystals and corrosion products with cuprous chloride (CuCl) was produced [26]. Figure 13 shows the Bode diagrams of Al-Cu coating applications at 1 h immersion time.…”
Section: Electrochemical Measurementsmentioning
confidence: 99%
“…Rpo is the resistance of the circuit to current flow through the pores, while Rsln represents the resistance of the electrolyte between the working electrode and the reference electrode, and Rct is the resistance to charge transfer. The time constant at higher frequencies in this circuit represents the dielectric pattern (CPEc and M) of the coating, and the time constant at lower frequencies represents the coating/substrate interface (CPEcd and N) properties [26]. The CPEs are a mathematical support that represents several elements of an electrical circuit.…”
Section: Electrochemical Measurementsmentioning
confidence: 99%
“…Since their discovery in the 1960s [1], Cu-based shape memory alloys (SMAs) have been widely used in engineering purposes due to their good thermal and electrical conductivity, moderate shape memory properties, and low cost of production in comparison with NiTi SMAs [2,3]. However, they represent poor strain recovery and formability as a result of brittleness in polycrystalline state, therefore, its practical application is limited [4][5][6][7]. Cu-Zn-Al and Cu-Al-Ni are the most commonly used alloys in Cu-based SMAs [8].…”
Section: Introductionmentioning
confidence: 99%
“…Cu-Al-Ni HTSMAs have been widely investigated due to its lower cost [3][4][5][6] in comparison with some well studied HTSMAs, such as Ti-Ni-Pd, TiTa and Ni-Mn-Ga [7][8][9][10][11][12][13][14][15], etc. However, polycrystalline Cu-Al-Ni alloys suffer from high brittleness, which is associated with large elastic anisotropy, intergranular cracking and large grain size [16,17].…”
Section: Introductionmentioning
confidence: 99%
“…However, polycrystalline Cu-Al-Ni alloys suffer from high brittleness, which is associated with large elastic anisotropy, intergranular cracking and large grain size [16,17]. Some methods were adopted to improve the mechanical properties of polycrystalline Cu-Al-Ni, including grain refinement [18] and fourth element addition [3,[19][20][21]. Published results showed that rare earth Gd addition can tailor the microstructure and mechanical properties of shape memory alloys [22][23][24], and accordingly, Gd is added into Cu-13.0Al-4.0Ni HTSMA to improve its plastic in the present work.…”
Section: Introductionmentioning
confidence: 99%