Influence of sintering process parameters on mechanical strength of joints based on silver nano particles

Abstract

Materials based on sintered silver nanoparticles seems to be an effective thermal interface materials for microelectronic packaging, especially in power electronics where the thermal management is a key problem of reliability. The main advantages of such materials is high thermal conductivity of silver, ease of application in integrated circuit production and relatively low temperature of sintering which is comparable with curing temperature of epoxy adhesives. Sintering process depends on such factor as time, temperature and pressure. Within this paper two different materials based on silver nanoparticles was tested and the influence of sintering process on the mechanical strength of joints was analyzed.

Technological aspects of silver particle sintering for electronic packaging

“…It is believed that the relevant additives in the sintered paste can noticeably affect the strength of the joint [e.g. epoxy resin (Fałat et al , 2014) or “sinter additives” (Schmitt, 2010)]. Pastes for sintering are prepared either in research laboratories or are delivered by producers.…”