Influence of surface properties on adhesion strength of dielectric passivation in chip size packaging

Suyama, Takuro; Suga, Kyôichi; Igarashi, Tomoyuki; Fujimori, Noriyuki

doi:10.23919/icep.2017.7939435

2017 International Conference on Electronics Packaging (ICEP) 2017

DOI: 10.23919/icep.2017.7939435

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Influence of surface properties on adhesion strength of dielectric passivation in chip size packaging

Takuro Suyama

Kyôichi Suga

Tomoyuki Igarashi

et al.

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Influence of surface properties on adhesion strength of dielectric passivation in chip size packaging

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References 2 publications

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