2020
DOI: 10.1016/j.wear.2020.203325
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Influence of the cutting direction angle on the tool wear behavior in face plunge grinding of PcBN

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Cited by 11 publications
(10 citation statements)
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“…The parameter variation of the conditioning process is performed ceteris paribus the rst test series (Table 1) and, in addition, the infeed of the conditioning tool per stroke a ed is varied as shown in Table 2. In the process, the time course of the power consumption of the grinding spindle is determined using the Tyrolit Toolscope in process measurement technology according to [13]. This data recorder enables the recording of the spindle power and position of the axes of the machine tool.…”
Section: Experimental Setup and Methodsmentioning
confidence: 99%
See 3 more Smart Citations
“…The parameter variation of the conditioning process is performed ceteris paribus the rst test series (Table 1) and, in addition, the infeed of the conditioning tool per stroke a ed is varied as shown in Table 2. In the process, the time course of the power consumption of the grinding spindle is determined using the Tyrolit Toolscope in process measurement technology according to [13]. This data recorder enables the recording of the spindle power and position of the axes of the machine tool.…”
Section: Experimental Setup and Methodsmentioning
confidence: 99%
“…P''' c is the slope of a linear regression of P' c to V' w . As shown by [13], the speci c spindle power is highly correlated with the speci c cutting energy, which depends not only on the chip formation but also on sliding in a grinding process. Both, attening of the diamond grains as well as grain dulling and weld build-up, lead to an increased coe cient of friction between grinding tool and workpiece.…”
Section: Experimental Setup and Methodsmentioning
confidence: 99%
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“…Denkena et al reported the formation of B 2 O 3 at a higher laser uence using picosecond and femtosecond lasers on a polycrystalline cubic boron nitride (PcBN) surface, distinguishing it from thermal effects such as melting using a nanosecond laser [21]. Therefore, a low uence is recommended, and the number of pulses, pulse energy, and laser spot size should be controlled.…”
Section: Motivation For Pulse Laser Processingmentioning
confidence: 99%