Influence of the interaction between chloride and thiourea on copper electrodeposition

Microstructural Refinement towards the Electrochemical Co–Deposition Recovery of Copper and Selenium

“…Furthermore, the peak reduction potential shifts negatively due to the addition of thiourea as an effective additive, as illustrated in Figure b. The onset potential shifts significantly from −0.25 to −0.53 V as thiourea increases from 0 to 1 mM, demonstrating the additive effect emerges after involving thiourea in this system . In addition, the peak current increases initially and then decreases as the thiourea concentration increases from 0 to 2 mM and from 2 to 10 mM, respectively.…”

“…The onset potential shifts significantly from À 0.25 to À 0.53 V as thiourea increases from 0 to 1 mM, demonstrating the additive effect emerges after involving thiourea in this system. [27][28][29] In addition, the peak current increases initially and then decreases as the thiourea concentration increases from 0 to 2 mM and from 2 to 10 mM, respectively. That is due to the balance between the beneficial effect of increasing nucleation sites and the detrimental effect of blocking the growth sites.…”

Synergistic effects of gelatin and convection on copper foil electrodeposition

“…All commercial electrodeposition baths contain additives to control the efficiency of copper foil production (e.g., to optimize the mass transport of reactants/products [4][5][6], or to change the surface reaction route [7,8]). Previous investigations have evaluated the effect of various organic additives such as thiorea [9,10], PEG (Polyethylene glycol)-chloride [11,12], SPS (bis (3-sulfopropyl) disulfide) [13,14], gelatin [15][16][17] and mixtures of different additives [18,19] on the copper deposition. Among them, gelatin is one of the safest additives in copper foil fabrication to meet the health considerations of toxic compounds used in industry [20].…”

The effect of quaternary ammonium-based ionic liquids on copper electrodeposition from acidic sulfate electrolyte

“…They may also influence the mechanism of electrocrystallization [5]. In this filed, organic substances, such as polyethylene glycol (PEG) [2,4], thiourea [6][7][8][9], benzotriazole [10,11], triethyl-benzyl-ammonium chloride (TEBA) [12], and saccharin [7], are widely used as leveling and brightening agents in copper electrodeposition in order to produce smooth, free of voids and porosity copper deposits. However, the research for better candidates as substitutes for these organic substances is continuing, since most of them are environmental unfriendly.…”