2007
DOI: 10.1016/j.apsusc.2007.07.115
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Influence of the plasma parameters and nitrogen addition on the electrical characteristics of DLC films deposited by inductively coupled plasma deposition

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Cited by 24 publications
(8 citation statements)
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“…Yet, the various nitrogen forms and their interrelations in plasma have not been covered in literature consistently [6][7][8]. Partly this is the reason that data referred in literature sometimes are contradictory [11][12][13].…”
Section: Introductionmentioning
confidence: 98%
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“…Yet, the various nitrogen forms and their interrelations in plasma have not been covered in literature consistently [6][7][8]. Partly this is the reason that data referred in literature sometimes are contradictory [11][12][13].…”
Section: Introductionmentioning
confidence: 98%
“…Actually, required properties of the films obtained by this method could easily be varied by changing the deposition parameters. The properties of coatings could be modified either by dopants [6][7][8] or structurally via the variation of technological parameters, i.e. power of ion source, voltage applied to substrate, availability of additional electric or magnetic fields, process geometry changes, etc.…”
Section: Introductionmentioning
confidence: 99%
“…Paul et al have studied the effect of gold-doped DLC on residual stress using a radiofrequency (RF) capacitively coupled plasma chemical vapor deposition (CCP-CVD) sputtering technique at room temperature [8]. In addition, numerous researchers and groups have synthesized N-DLC thin films using various deposition methods such as microwave surface-wave plasma CVD [9], DC magnetron sputtering [10], electron cyclotron resonanceassisted microwave plasma CVD (ECR-MPCVD) [11], and inductively coupled plasma deposition (ICP) systems [1,12].…”
Section: Introductionmentioning
confidence: 99%
“…It is pointed out that a band gap of DLC films can be changed by the ratio of bonding state, trihedral (sp 2 ) to tetrahedral (sp 3 ), regardless of the amorphous structure. Moreover, the pn-conduction type is also expected to be controllable using some impurities, such as boron (B), [1][2][3] nitrogen (N), [4][5][6][7][8][9] and phosphorus (P). 3,[10][11][12][13] N is one of the convenient elements for doping DLC films.…”
Section: Introductionmentioning
confidence: 99%
“…Nitrogen gas (N 2 ) is used as a source gas and is easy to add into a DLC deposition system. Therefore, many studies have been carried out using a variety of deposition methods, such as sputtering, 4,5) inductively coupled plasma-chemical vapor deposition (ICP-CVD), 6) and microwave surface-wave plasma (MW-SWP) CVD. [7][8][9] However, DLC films usually have very high electrical resistivity, generally spanning from 10 2 to 10 16 cm.…”
Section: Introductionmentioning
confidence: 99%