Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn–3.0Ag–0.5Cu–xTiO2 composite solder

Tang, Yu; Pan, Y.C.; Li, G. Y.

doi:10.1007/s10854-012-0980-6

Cited by 22 publications

(8 citation statements)

References 23 publications

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“…Our previous studies [16][17] show that adding TiO 2 nanoparticles into Sn-3.0Ag-0.5Cu solder can effectively inhibit IMC growth and refine the grain size at the interface of the solder joints during soldering. However, during actual working conditions, the solder joints are subjected to solid-state aging conditions such as continuous use of electronic equipment, temperature storage, and power on-off cycles.…”

Section: A N U S C R I P Tmentioning

confidence: 99%

Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn 3.0Ag 0.5Cu xTiO2 solder joints

Tang

Luo

Wang

et al. 2016

Journal of Alloys and Compounds

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Section: A N U S C R I P Tmentioning

confidence: 99%

Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn 3.0Ag 0.5Cu xTiO2 solder joints

Tang

Luo

Wang

et al. 2016

Journal of Alloys and Compounds

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“…The agglomerated dust particles result in a decrease in the energy level. 34 This in turn affects the surface energy of the solder-substrate and increases the value of γ ls . The increase in the solder-substrate surface energy decreases the value of COS θ and increases the contact angle between the solder and the substrate, which is attributed to the addition of reinforcement particles.…”

Section: Wettabilitymentioning

confidence: 99%

Manufacturing and Characterization of Sn-0.6Al Lead-Free Composite Solder Using Accumulative Extrusion Process

Bakhtiarvand

Taherizadeh

Maleki

et al. 2021

J. Electron. Mater.

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In this research, the manufacturing and characterization of a Sn-Al lead-free solder composite, reinforced with electric arc furnace dust, through an accumulative extrusion process was studied. To this end, one eutectic Sn-0.6Al solder alloy and three composite lead-free solders Sn-0.6Al/X%D (X = 0.5, 1, 1.5) were fabricated. The microstructure of the solders was investigated using x-ray diffraction (XRD) and a scanning electron microscope (SEM) equipped with an energy dispersion spectroscopy (EDS) detector. Thermal characteristics of the samples were investigated using differential scanning calorimetry (DSC). The wetting angle, density, electrical resistivity, microhardness, tensile strength and shear strength of the samples were also measured. The results of microstructural investigations indicated that the solder comprises the β-Sn phase and has a eutectic microstructure, and the increase in the number of accumulative extrusion passes results in a better, more uniform distribution of Al in the Sn matrix. The results of DSC tests showed a decrease in the melting point of the Sn-0.6Al solder alloy, which indicates successful alloying. The results showed that the contact angle of the Sn-0.6Al solder alloy with the substrate was 37° and the wetting angles of the Sn-0.6Al/X%D (X = 0.5, 1, 1.5) composite solders were 39°, 42° and 72°, respectively. Density measurements showed that, by fabrication of the Sn-0.6Al eutectic solder alloy, the density of the composite solder can be reduced by up to 18% compared to the Sn-37Pb alloy. Electrical resistivity measurements indicated that electrical resistivity of Sn-0.6Al/X%D (X = 0.5, 1, 1.5) composite solders was comparable to Sn-37Pb solder. Finally, mechanical test results showed that, by addition of 1% reinforcement particles, the microhardness, ultimate tensile strength and shear strength are improved. KeywordsAccumulative extrusion • electrical properties • lead-free solder • mechanical properties • metal matrix composite • physical properties • solder * A. Taherizadeh

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“…Besides, the addition of TiO 2 does not modify the solidus temperatures of the composite solder. However, the liquidus temperature increases by 4.4°C with an increase in amounts of TiO 2 nanoparticles [11].…”

Section: Introductionmentioning

confidence: 98%

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching

Yahaya

Nazeri

Kheawhom

et al. 2020

Mater. Res. Express

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This work aims to provide deep morphological observation on the incorporated TiO 2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β-Sn matrix was conducted at a fixed potential of −350 mV. Average performances of 2.19 and 2.30 mA were attained from the chronoamperometry. The efficiency of β-Sn removal was approved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO 2 near the Cu 6 Sn 5 layer was attained for an optimum duration of 120 s. Clusters of TiO 2 nanoparticles were entrapped by Cu 6 Sn 5 and Ag 3 Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO 2 nanoparticles at the solder interface suppresses the growth of the Cu 6 Sn 5 IMC layer. The absence of a β-Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu 6 Sn 5 and Ag 3 Sn. It was found that TiO 2 content facilitates the β-Sn removal, which allows better observation of the IMC phases as well as the TiO 2 reinforcement particles.

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Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn–3.0Ag–0.5Cu–xTiO2 composite solder

Cited by 22 publications

References 23 publications

Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn 3.0Ag 0.5Cu xTiO2 solder joints

Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn 3.0Ag 0.5Cu xTiO2 solder joints

Manufacturing and Characterization of Sn-0.6Al Lead-Free Composite Solder Using Accumulative Extrusion Process

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching

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Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn–3.0Ag–0.5Cu–xTiO2 composite solder

Cited by 22 publications

References 23 publications

Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn 3.0Ag 0.5Cu xTiO2 solder joints

Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn 3.0Ag 0.5Cu xTiO2 solder joints

Manufacturing and Characterization of Sn-0.6Al Lead-Free Composite Solder Using Accumulative Extrusion Process

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

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Product

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Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching