Influence of α-Si3N4 coarse powder on densification, microstructure, mechanical properties, and thermal behavior of silicon nitride ceramics

Lv, Xiaoan; Huang, Junwei; Dong, Xiaofeng; Yan, Qingzhi; Chen, Ge

doi:10.1016/j.ceramint.2023.04.003

Cited by 19 publications

(3 citation statements)

References 30 publications

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“…Relation between thermal conductivity and bending strength for Si 3 N 4 sintered by different routes. GPS, 14,28,40–45 gas pressure sintered; SRBSN, sintered reaction‐bonded silicon nitride 2,16,18,46,47 ; HP, hot pressing 48–50 ; SPS, spark plasma sintering 51,52 ; PLS, pressureless sintering 33 ; HPFS, hot‐pressing flowing sintering.…”

Section: Resultsmentioning

confidence: 99%

Fabrication of silicon nitride with high thermal conductivity and flexural strength by hot‐pressing flowing sintering

Li,

Jiang,

Pan

et al. 2024

Int J Applied Ceramic Tech

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The silicon nitride (Si3N4) possessing enhanced thermal conductivity and flexural strength was sintered by a hot‐pressing flowing sintering (HPFS) method. The effects of extrusion deformation and sintering additives on the density, phase, microstructure, and performances of Si3N4 fabricated by HPFS were investigated. As the strain increased from 67% to 167%, the mean grain diameter of Si3N4 with MgSiN2 as an additive increased by 49%, reaching 1.36 ± .6 µm. The addition of MgSiN2–Y2O3 resulted in a significantly stronger degree of texturing and smaller grain diameter in Si3N4, compared to the incorporation of MgSiN2 alone. The thermal conductivity of Si3N4 with added MgSiN2–Y2O3 increased to 109.1 W m−1 K−1 in the flow direction, and the flexural strength reached the maximum value of 1250.8 ± 39 MPa in the hot‐pressing direction. The results showed that the thermal conductivity and flexure strength of Si3N4 were enhanced due to the formation of texture and the reduction of flaws induced by HPFS. Moreover, HPFS method exhibited outstanding controllability over the microstructures and properties of materials.

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Section: Resultsmentioning

confidence: 99%

Fabrication of silicon nitride with high thermal conductivity and flexural strength by hot‐pressing flowing sintering

Li,

Jiang,

Pan

et al. 2024

Int J Applied Ceramic Tech

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show abstract

“…Si 3 N 4 is often used in the aerospace and military industry, mechanical engineering, communications, electronics, automotive, energy, chemical and biological fields. It is particularly promising for electronic packaging substrate applications, suitable for applications in complex and extreme environments [ 1 , 2 , 3 ].…”

Section: Introductionmentioning

confidence: 99%

Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics

Zhang,

Gao,

Zhang

et al. 2023

Micromachines

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For the slicing of superhard silicon nitride ceramics, diamond wire sawing technology has great potential for application, and its slicing surface characteristics are an important indicator of cutting quality. In this paper, the sawing experiments of silicon nitride ceramics were carried out within the range of industrial processing parameters of diamond wire sawing (saw wire speed: 800–1600 m/min, workpiece feed speed 0.1–0.4 mm/min). The effects of cutting parameters on the surface morphology, surface roughness and waviness of the as-sawn slices were analyzed. The results show that within the range of sawing parameters for industrial applications, the material on the diamond wire as-sawn surface of silicon nitride ceramics is removed mainly in a brittle mode, with the slice morphology showing brittle pits and regularly distributed wire marks in the 20–55 μm scale range. The surface roughness of the slices along the workpiece feed direction ranges from 0.27 to 0.38 μm and decreases with increasing saw wire speed and decreasing feed rate. The surface waviness ranges from 0.09 to 0.21 μm, which is in good agreement with the changing trend of the sliced-surface roughness. The results of the study provide an experimental reference for promoting the engineering application of diamond wire sawing technology to the processing of silicon nitride ceramic slices.

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“…Additionally, much research [ 31 , 32 , 33 ] has indicated that the bimodal distribution [ 34 ] of Si 3 N 4 ceramics with more columnar β-Si 3 N 4 grains is advantageous to improve the strength and toughness by introducing low-cost β-Si 3 N 4 [ 35 ] whiskers [ 27 ] and/or seeds [ 36 ]. In addition, generally, various reinforced particles such as TiC [ 37 ], TiN [ 5 , 27 ], Ti(C, N) [ 11 ], WC [ 38 ], SiC [ 4 ] and graphene [ 39 ] are also mixed into Si 3 N 4 -based ceramics [ 35 ] to enhance their properties.…”

Section: Introductionmentioning

confidence: 99%

Synergistic Reinforcement of Si3N4 Based Ceramics Fabricated via Multiphase Strengthening under Low Temperature and Short Holding Time

Huang,

Lv,

Dong

et al. 2023

Materials

Self Cite

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Si3N4 ceramic as a tool material shows promising application prospects in high-speed machining fields; however, the required high mechanical properties and low-cost preparation of Si3N4 ceramic tool materials restrict its application. Herein, synergistic reinforced Si3N4 ceramic tool materials were fabricated by adding β-Si3N4 seeds, inexpensive Si3N4 whiskers and TiC particles into coarse commercial Si3N4 powder (D50 = 1.5 μm), then sintering by hot-pressing with low temperature and short holding time (1600 °C—30 min—40 MPa). The phase assemblage, microstructure evolution and toughening mechanisms were investigated. The results reveal that the sintered Si3N4 ceramics with synergistic reinforcement, compared to those with individual reinforcement, present an enhancement in relative density (from 94.92% to 97.15%), flexural strength (from 467.56 ± 36.48 to 809.10 ± 45.59 MPa), and fracture toughness (from 8.38 ± 0.19 to 10.67 ± 0.16 MPa·m1/2), as well as a fine Vickers hardness of 16.86 ± 0.19 GPa. Additionally, the various reinforcement modes of Si3N4 ceramics including intergranular fracture, crack deflection, crack bridging and whiskers extraction were observed in crack propagation, arising from the contributions of the added β-Si3N4 seeds, Si3N4 whiskers and TiC particles. This work is expected to serve as a reference for the production of ceramic cutting tools.

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Influence of α-Si3N4 coarse powder on densification, microstructure, mechanical properties, and thermal behavior of silicon nitride ceramics

Cited by 19 publications

References 30 publications

Fabrication of silicon nitride with high thermal conductivity and flexural strength by hot‐pressing flowing sintering

Fabrication of silicon nitride with high thermal conductivity and flexural strength by hot‐pressing flowing sintering

Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics

Synergistic Reinforcement of Si3N4 Based Ceramics Fabricated via Multiphase Strengthening under Low Temperature and Short Holding Time

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