2021
DOI: 10.1002/app.51189
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Influences of different imidization conditions on polyimide fiber properties and structure

Abstract: In the present work we prepared co-polyimide (PI) fibers with excellent mechanical and dielectric properties by the wet-spinning method. The co-PI fiber exhibited high mechanical property with a tensile strength of 2.61 GPa and modulus of 86.7 Gpa as well as a low dielectric constant and a dielectric loss factor of 2.7463 and 0.00793 at 10 GHz, respectively. The relationship between the properties and the microstructure of co-PI fibers after heatdrawing was investigated. The results revealed that the hydrogen-… Show more

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Cited by 9 publications
(8 citation statements)
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“…The influences of the thermal treatment temperature on the structure and properties of the PI fibers were also studied, both of the molecular chain relaxation and the evolution of aligned microvoids induced by post-thermal treatment resulted in the change in tensile modulus. [28][29][30][31] Wang et al [32] investigated influences of different imidization conditions on PI fiber properties and structure, the results indicated that the imidization conditions affected the mechanical properties of the fiber by affecting the hydrogen-bond associations and the microvoids structure.…”
Section: Doi: 101002/mats202100081mentioning
confidence: 99%
See 1 more Smart Citation
“…The influences of the thermal treatment temperature on the structure and properties of the PI fibers were also studied, both of the molecular chain relaxation and the evolution of aligned microvoids induced by post-thermal treatment resulted in the change in tensile modulus. [28][29][30][31] Wang et al [32] investigated influences of different imidization conditions on PI fiber properties and structure, the results indicated that the imidization conditions affected the mechanical properties of the fiber by affecting the hydrogen-bond associations and the microvoids structure.…”
Section: Doi: 101002/mats202100081mentioning
confidence: 99%
“…[ 28–31 ] Wang et al. [ 32 ] investigated influences of different imidization conditions on PI fiber properties and structure, the results indicated that the imidization conditions affected the mechanical properties of the fiber by affecting the hydrogen‐bond associations and the microvoids structure.…”
Section: Introductionmentioning
confidence: 99%
“…The density of polymer materials is far lower than that of metals and ceramics, and with the development of material technology, their other properties have also been greatly improved. Among these polymer materials, polyimide (PI) film materials have outstanding properties [ 2 , 3 , 4 , 5 , 6 , 7 , 8 ]: low density, high mechanical properties, great thermal stability, radiation resistance, corrosion resistance, excellent dielectric properties, and so on. Therefore, PI films can be used in microelectronics, aerospace, and other fields [ 9 , 10 , 11 , 12 ].…”
Section: Introductionmentioning
confidence: 99%
“…29,30 In previous work, some aromatic PIs and poly(ether imide)s containing di-and triarylimidazolyl units into the polymer backbone or as bulky pendant groups have been reported. [31][32][33][34][35][36][37][38][39] In this paper, with an aim to develop high performance and processable PIs, a new kind of unsymmetrical diamine containing tetraarylimidazolyl and trifluoromethyl groups, 1,2diphenyl-4,5-bis(4-trifluoromethylphenyl)-1H-imidazole, has been synthesized successfully. Meanwhile, a new series of fluorinated imidazolyl-containing PIs were synthesized derived from the resulting diamine monomer.…”
Section: Introductionmentioning
confidence: 99%