“…The density of polymer materials is far lower than that of metals and ceramics, and with the development of material technology, their other properties have also been greatly improved. Among these polymer materials, polyimide (PI) film materials have outstanding properties [ 2 , 3 , 4 , 5 , 6 , 7 , 8 ]: low density, high mechanical properties, great thermal stability, radiation resistance, corrosion resistance, excellent dielectric properties, and so on. Therefore, PI films can be used in microelectronics, aerospace, and other fields [ 9 , 10 , 11 , 12 ].…”