2006
DOI: 10.1016/j.jnoncrysol.2005.11.148
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Influences of GeF4 on poly-SiGe films prepared by reactive thermal CVD

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Cited by 5 publications
(5 citation statements)
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“…Progress in the research of germanium fluoride compounds could have important contributions in a variety of fields. In fact, one of the well-established procedures for the preparation of Si–Ge thin films includes disilane and germanium tetrafluoride, , thus the basic reactivity of GeF 4 and its properties are worthy of research.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Progress in the research of germanium fluoride compounds could have important contributions in a variety of fields. In fact, one of the well-established procedures for the preparation of Si–Ge thin films includes disilane and germanium tetrafluoride, , thus the basic reactivity of GeF 4 and its properties are worthy of research.…”
Section: Introductionmentioning
confidence: 99%
“…This notion reveals itself in the structures of XeF 5 GeF 5 and ClO 2 GeF 5 , which consist of infinite chains of GeF 6 octahedra. 10 According to evidence provided by vibrational spectroscopy, polymeric GeF 5 − anion composed of fluoride-bridged GeF 6 octahedra appears also in salts with [(C 6 H 5 ) 4 As] + , [(C 3 H 7 ) 4 N] + , [(CH 3 ) 4 N] + , NF 4 + , NO 2 + , SF 3 + , and O 2 + cations. However, these reports lack the crystal structure characterization.…”
Section: ■ Introductionmentioning
confidence: 99%
“…Carbon tetrafluoride is extremely stable and resistant to hydrolysis and is employed in the semiconductor industry to generate the chemically active F atoms in etching and cleaning processes 1. The tetrafluorides of Si and Ge are less stable than CF 4 2 and are effectively used to deposit thin films of electronic materials by chemical vapor deposition techniques 3–7. The processes are commenced by radiofrequencies or electric discharges, which dissociate the substrates to form the gaseous reactive intermediates that initiate the eventual formation of the solids.…”
Section: Introductionmentioning
confidence: 99%
“…This is because the incorporation of germanium promotes the formation of crystal grains in the films. [12] As shown in Fig. 5, the surface morphology varies with different GCs, which is relevant to the growth of alloys.…”
Section: Discussionmentioning
confidence: 98%
“…But the growth rates of the films prepared by these methods are always low and plenty of dangling bonds are formed with increasing GC. Zhang et al [12] made a TFT device by using reactive thermal chemical vapour deposition (RTCVD) which exhibited a good promise to solving these problems. However, a high substrate temperature exceeding 400 • C is needed for this technology, which limits the use of many flexible or low cost substrates.…”
Section: Introductionmentioning
confidence: 99%