Influences on the reflow soldering process by components with specific thermal properties

Abstract

Article information:To cite this document: Florian Schüßler, Denis Kozic, Jörg Franke, (2009),"Influences on the reflow soldering process by components with specific thermal properties", Circuit World, Vol. Access to this document was granted through an Emerald subscription provided by FRIEDRICH ALEXANDER UNIVERSITAET ERLANGEN NUERNBERG For Authors: If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service. Information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comWith over forty years' experience, Emerald Group Publishing is a leading independent publisher of global research with impact in business, society, public policy and education. In total, Emerald publishes over 275 journals and more than 130 book series, as well as an extensive range of online products and services. Emerald is both COUNTER 3 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation.*Related content and download information correct at time of download. Influences on the reflow soldering process by components with specific thermal properties Florian Schüßler, Denis Kozic and Jörg FrankeInstitute for Manufacturing Automation and Production Systems (FAPS), University of Erlangen-Nuremberg, Erlangen, Germany Abstract Purpose -The purpose of the paper is to focus on the research into components with specific thermal properties and their influences on the reflow soldering process. Design/methodology/approach -After a brief introduction, the paper gives an overview of the necessity of thermal management on printed circuit boards (PCBs) and the possible effects on the manufacturing of electronic devices. In the next sections, different test boards are presented for investigations into different thermal effects during soldering. The last section deals with the influences of molded interconnected devices (MIDs) on the reflow soldering process. Findings -The investigations show that components from the thermal management influence the reflow soldering process more or less. The highest impacts on the soldering process are from components with a thermal connection to the electrical component and its solder joint. All results from the investigations have in common that the thermal influence can only be compensated by increasing the temperature during soldering. However, this significantly increases the risk of overheating the electrical components or the PCB itself. Research limitations/implications -This paper shows only the influence of some of the effects caused by thermal management on the reflow soldering process. Furthermore, vapour phase soldering is not considered, but actual investigations are carried out on vapour phase soldering ovens as well. Originality/value -Thermal management becomes more and mor...

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

“…The standard procedures involved in reflow soldering are shown in Figure 3. However, the margin of BGA solder joint and pitch dimensions in packaging technology are continually scaled down as a future trend, leading to more complex thermal responses when the PCB assembly passes through the reflow oven (Schüßler et al , 2009). A loss of productivity of 30-50 per cent of the total manufacturing costs was reported by Tsai (2012b) for the additional repair and rework of defective products.…”

“…Thus, the use of lead-free soldering has increased the challenges of reflow thermal profiling. Apart from that, the thermal properties of the various packages have a significant effect on the reflow thermal profiling (Schüßler et al , 2009). For example, higher thermal energy was dissipated from components with larger thermal vias; this required increasing the peak temperature of the reflow process to allow sufficient heating.…”