We describe heteroepitaxy of narrow gap semiconductor (NGS) layers on Si-substrates, and fabrication of photovoltaic JR-sensor arrays in the NGS layers. We rather use lead chalcogenides (PbS, PbTe, Pb1EuSe and Pb1SnSe) than Hg1CdTe (MCT) as NGS material for sensor integration because maximum sensitivities are comparable in both families, while growth and fabrication techniques are much easier and compositional homogeneity much less critical with lead salts. The high permittivity of lead salts yields to much more fault tolerant devices due to the effective shielding ofcharges resulting from defects. The somewhat slower response time of lead salts is of no importance for photovoltaic JR-focal plane arrays for thermal imaging applications. Epitaxy of the NGS layers is achieved by using stacked intermediate CaF2-BaF2 bilayers to overcome the large lattice-and thermal expansion mismatch. We have now fabricated linear sensor arrays on Si-substrates with cutoff wavelengths ranging from 3 j.tm (with PbS and Pb1EuSe) and 5.5 j.m (PbTe) up to >12 p.m (Pb1Sn1Se). The sensitivities of our best PbTe on Si sensors are already as high as those of MCT with comparable cut-off wavelengths, while those of our first Pb1SnSe devices are a factor 2-5 below. This despite many of our fabrication steps are rather crude and far from being optimized, and considerable improvement is still possible.