Inhibition of copper corrosion in 1M nitric acid with benzoyl benzaldehyde hydrazone derivatives

Abstract

The effect of substituted benzoyl benzaldehyde hydrazone derivatives on the inhibition of copper corrosion in 1M nitric acid solution at 303 K was investigated by potentiodynamic and weight-loss measurements. A significant decrease in the corrosion rate of copper was observed in the presence of the investigated compounds. The corrosion rate was found to depend on the nature and the concentration of the inhibitors. The Tafel slope is approximately constant independent of the concentration of the inhibitor. The observed corrosion data indicate that the inhibition of copper corrosion is due to surface adsorption of inhibitor molecules which follow the Langmuir adsorption isotherm. The results of potentiodynamic measurements indicate that all investigated compounds act mainly cathodically.Die Wirkung von Benzoylbenzaldehydhydrazinderivaten auf die Inhibierung der Kupferkorrosion in 1M Salpetersaure-Losungen bei 303 K wurde mit Hilfe potentiodynamischer und Massenverlustmessungen untersucht. Bei Zugabe der verwendeten Substanzen ergab sich eine deutliche Abnahme der Korrosionsgeschwindigkeit des Kupfers. Die Korrosionsgeschwindigkeit hangt dabei von der Beschaffenheit und der Konzentration des Inhibitors ab. Die Neigung der Tafelgeraden ist unabhangig von der Konzentration des Inhibitors annahernd konstant. Die ermittelten Korrosionsdaten deuten an, dal3 die Inhibierung der Rupferkorrosion auf die Oberflachenadsorption der lnhibitormolekiile zuriickgefiihrt werden kann, die der Langmuir-Adsorptions-Isotherme folgen. Die Ergebnisse der potentiodynamischen Messungen lassen darauf schlie-Ben, daB alle untersuchten Substanzen im wesentlichen kathodisch wirken.

Synthesis, description, and application of novel corrosion inhibitors for CS AISI1095 in 1.0 M HCl based on benzoquinoline derivatives

“…Table 1 compares one of the inhibitors we investigated with those from the literature that are comparable in terms of chemistry and active function groups 26 – 28 .…”

Interaction of Two Water Soluble Heterocyclic Hydrazones on Copper in Nitric Acid: Electrochemical, Surface Morphological, and Quantum Chemical Investigations

“…The chemical dissolution and electroplating of copper are the main processes used in the fabrication of electronic devices. The most widely used aggressive solution contains nitric acid and hence this medium has induced a great deal of research on copper corrosion [1][2][3][4]. The most practical way to decrease the rate of corrosion in acidic medium is the use of corrosion inhibitors.…”