GaAs metal–oxide–semiconductor devices
historically
suffer from Fermi-level pinning, which is mainly due to the high trap
density of states at the oxide/GaAs interface. In this work, we present
a new way of passivating the interface trap states by growing an epitaxial
layer of high-k dielectric oxide, La2–x
Y
x
O3, on GaAs(111)A.
High-quality epitaxial La2–x
Y
x
O3 thin films are achieved by
an ex situ atomic layer deposition (ALD) process, and GaAs MOS capacitors
made from this epitaxial structure show very good interface quality
with small frequency dispersion and low interface trap densities (D
it). In particular, the La2O3/GaAs interface, which has a lattice mismatch of only 0.04%,
shows very low D
it in the GaAs bandgap,
below 3 × 1011 cm–2 eV–1 near the conduction band edge. The La2O3/GaAs
capacitors also show the lowest frequency dispersion of any dielectric
on GaAs. This is the first achievement of such low trap densities
for oxides on GaAs.