2010
DOI: 10.1016/j.jelechem.2010.05.002
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Initial stages of the electrocrystallization of copper from non-cyanide alkaline bath containing glycine

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Cited by 55 publications
(31 citation statements)
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“…The aforementioned characteristic features occur not immediately at applied potential but after an induction time as mentioned by several authors (as Torrent et al [27] with lead chloride and sulphate electrocryztallisations on a lead amalgam substrate or Ballesteros et al [28] with copper electrocryztallisation onto nickel substrate). This period can correspond to an initial electrochemical reaction and could be managed with the dedicated theoretical frameworks [29][30][31][32][33] e.g.…”
Section: Analysis Of Current Transientsmentioning
confidence: 84%
“…The aforementioned characteristic features occur not immediately at applied potential but after an induction time as mentioned by several authors (as Torrent et al [27] with lead chloride and sulphate electrocryztallisations on a lead amalgam substrate or Ballesteros et al [28] with copper electrocryztallisation onto nickel substrate). This period can correspond to an initial electrochemical reaction and could be managed with the dedicated theoretical frameworks [29][30][31][32][33] e.g.…”
Section: Analysis Of Current Transientsmentioning
confidence: 84%
“…The morphology control can be achieved by the application of the additives during the deposition process. [21][22][23] For instance, branched polyethyleneimine (BPEI) was reported to affect the morphology and the electrodeposition kinetics of zinc in ZnSO 4 solution. The presence of BPEI could alter the morphology of the electrodeposited layer from laminated hexagonal large crystals to an amorphous compact layer.…”
Section: Introductionmentioning
confidence: 99%
“…[7][8][9][10][11] Ballesteros et al observed the effect of Cu (II) concentration, glycine concentration and deposition potential on the electrocrystallisation of copper onto nickel electrode at pH 10 and reported that glycine acts not only as an effective ligand in producing stable copper complexes but as a good levelling agent resulting in homogeneous copper coatings. 9 According to DrissiDaoudi et al 12 cuprous complex is an intermediate in the cupric complex reduction but is not detected during the oxidation of electrodeposited copper in the solution containing Cu (II)-glycinate complex at pH 10. The effect of organic additives in copper plating is very important in achieving good quality copper deposits and therefore has been reported in numerous works.…”
Section: Introductionmentioning
confidence: 99%