2019
DOI: 10.1007/s10443-019-09775-5
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Injection-Compression-Compression Process for Preparation of High-Performance Conductive Polymeric Composites

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Cited by 4 publications
(2 citation statements)
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“…For example, a hot embossing device provided pressing force up to 50 kN with a speed of 0.005 to 0.5 J o u r n a l P r e -p r o o f mm/s for processing SCF/PDMS composite sheets [8]. An injection-compression-compression process generated a maximum barrel pressure of 400 MPa for preparing polypropylene/SCF composites, and a maximum electrical conductivity was achieved for a compression speed of 20 mm/s [15]. Building on the SCFNA method, the current CSNA process has the pressing force and rolling speed as the two key parameters, which should be carefully designed within a certain range, and can be guided by application of equations 1 to 5.…”
Section: J O U R N a L P R E -P R O O Fmentioning
confidence: 99%
“…For example, a hot embossing device provided pressing force up to 50 kN with a speed of 0.005 to 0.5 J o u r n a l P r e -p r o o f mm/s for processing SCF/PDMS composite sheets [8]. An injection-compression-compression process generated a maximum barrel pressure of 400 MPa for preparing polypropylene/SCF composites, and a maximum electrical conductivity was achieved for a compression speed of 20 mm/s [15]. Building on the SCFNA method, the current CSNA process has the pressing force and rolling speed as the two key parameters, which should be carefully designed within a certain range, and can be guided by application of equations 1 to 5.…”
Section: J O U R N a L P R E -P R O O Fmentioning
confidence: 99%
“…In particular, because PI fibers can be used within a wide range of temperatures, they match well with the ultrahigh temperature and pressure applied in the processing conditions of high performance resins and achieve long-term service stability under extreme environments. [6][7][8][9][10][11][12][13][14] In addition, the low dielectric constant and loss of PI fibers also make them a promising substance in the manufacturing of structural-functional integration materials for wavetransparent applications, such as in the radomes of satellite or 5G base stations, providing a new approach to the material design and selection of advanced composites. [15][16][17][18] At present, the primary problem of applying PI resins prepared using a polymerization monomeric reactant (PMR) method is the difficulty in molding.…”
Section: Introductionmentioning
confidence: 99%